Micron Technology Incorporated

Allen R Gibson

Yi Hu

Dave Pratt

Raju Ahmed

Frank Speetjens

Yung-Ta Sung

Siva Naga Sandeep Chalamalasetty

Aaron Kenneth Belsher

Darin Miller

Some embodiments include a method of forming an integrated assembly. An arrangement is formed to include a conductive pillar extending through an insulative mass. An upper surface of the conductive pillar is recessed to form a cavity. An insulative collar is formed within the cavity to line an outer lateral periphery of the cavity. A recessed surface of the conductive pillar is exposed at a bottom of the lined cavity. A conductive expanse is formed over the insulative mass. A portion of the conductive expanse extends into the cavity and is configured as an interconnect. The conductive expanse is patterned into multiple conductive structures. One of the conductive structures includes the interconnect.

Conductive interconnects and methods of forming conductive interconnects

Growing community of inventors

Boise, ID, United States of America

Allen R Gibson