Kla Tencor Corporation

Kla-tencor Technologies Corporation

Allen M Carroll

Mark Armstrong McCord

Yehiel Gotkis

Walter Dean Mieher

Alan D Brodie

Paul F Petric

Luca Grella

Leonid Baranov

Compression, transmission and decompression of gray-tone imagery data includes receiving a gray-tone image suitable for printing at least a portion of a pattern onto a substrate by operation of an electron beam lithography system, aggregating sets of lines of the gray-tone image into trilines, sequentially encoding each of the trilines of the gray-tone image by operation of one or more encoders, the one or more encoders equipped with a codebook configured to store a plurality of triline fragments and a write location and transmitting the encoded trilines of the gray-tone image to a set of decoders of the digital pattern generator via a set of data pathways established between the one or more encoders and each of the decoders.

System and method for compressed data transmission in a maskless lithography system

One embodiment relates to a pillar-supported array of micro electron lenses. The micro-lens array includes a base layer on a substrate, the base layer including an array of base electrode pads and an insulating border surrounding the base electrode pads so as to electrically isolate the base electrode pads from each other. The micro-lens array further includes an array of lens holes aligned with the array of base electrode pads and one or more stacked electrode layers having openings aligned with the array of lens holes. The micro-lens array further includes one or more layers of insulating pillars, each layer of insulating pillars supporting a stacked electrode layer. Another embodiment relates to a method of fabricating a pillar-supported array of micro electron lenses. Other embodiments, aspects and features are also disclosed.

Pillar-supported array of micro electron lenses

One embodiment relates to a method of measuring overlay errors for a programmable pattern, area-imaging electron beam lithography apparatus. Patterned cells of an overlay measurement target array may be printed in swaths such that they are superposed on patterned cells of a first (base) array. In addition, the overlay array may have controlled-exposure areas distributed within the swaths. The superposed cells of the overlay and base arrays are imaged. The overlay errors are then measured based on distortions between the two arrays in the image data. Alternatively, non-imaging methods, such as using scatterometry, may be used. Another embodiment relates to a method for correcting overlay errors for an electron beam lithography apparatus. Overlay errors for a pattern to be printed are determined based on within-swath exposure conditions. The pattern is then pre-distorted to compensate for the overlay errors. Other embodiments, aspects and features are also disclosed.

Methods of measuring overlay errors in area-imaging e-beam lithography

One embodiment relates to a pattern data system for maskless electron beam lithography. The system includes a renderer that receives pre-exposure die image data, performs rendering of the pre-exposure die image data to generate raster data. The system further includes a plurality of data distributors communicatively coupled to the renderer. Each data distributor adapts the raster data to characteristics of an associated pattern writer. Other embodiments, aspects and feature are also disclosed.

Pattern data system for high-performance maskless electron beam lithography

One embodiment relates to an electron-beam apparatus for writing a pattern on a target substrate. The apparatus includes a plurality of arrays of actively-controlled pixel elements at a surface of a reflective electron patterning device. The plurality of arrays of actively-controlled pixel elements are arranged so that there is an area without any actively-controlled pixel elements in a region surrounding an optical axis of the objective lens. The plurality of arrays may be arranged to each lie on a circle centered on the optical axis. Other features, aspects and embodiments are also disclosed.

Quasi-annular reflective electron patterning device

A method for creating an electron beam pattern exposure, where a pattern of shapes is generated, including at least one of lines and vias. To each shape there is assigned a set of exposure pixels and edge placement constraints. An intensity at each exposure pixel is calculated by using a simplex method, and a latent resist image location is calculated by convolving a proximity function with the pixel intensities. A shape critical dimension and a shape edge slope is statistically evaluated by applying linear regression on the locations of the calculated latent image. The electron beam pattern exposures are produced using dosages linearly optimized on a rotated pixel grid to produce the shape critical dimension and the shape edge slope.

Electron beam patterning

Embodiments of the invention include an electron beam lithography device using a dynamically controllable photocathode capable of producing a patterned electron beam. One such implementation includes a dynamic pattern generator configurable to produce an electron beam having a desired image pattern impressed thereon. Such an electron beam pattern being enabled by selectively activating programmable photoemissive elements of the pattern generator. The apparatus further including an illumination source arranged to direct a light beam onto the dynamic pattern generator to produce the electron beam having the desired pattern. The electron beam being directed through associated electron optics configured to receive the electron beam from the dynamic pattern generator and direct the electron beam onto a target substrate mounted on a stage.

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San Jose, CA, United States of America

Allen M Carroll