Raytheon Company

Allen L Kelly

William C Strauss

Christopher K Solecki

Richard L Gentilman

Justin Kasemodel

Derrick J Rockosi

Justin E Stroup

Brian Gahan

Amanda M Couch

John C Sherrill

Kevin Chapla

Christopher J Fisher

Randy L Smith

Kevin M Chapla

An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.

System and method for creating orthogonal solder interconnects

A system for contactless testing of radio frequency apertures is provided. The system comprises a fixture having a fixture mount operable to be received in a fixture receiver of a robotic system, and a vector network analyzer ('VNA') supported by the fixture. A radiating antenna is supported by the fixture, and is operable to be connected to the VNA via a cable. Upon movement of the fixture via the robotic system, the VNA, the radiating antenna, and the cable maintain a static positional relationship relative to one another.

System for contactless testing of radio frequency apertures

An apparatus for producing a layer of vitreous silica adjacent at least a portion of an inner surface of a fused silica body is described, comprising a heat source disposed to apply sufficient heat to at least a portion of the inner surface to cause a layer of said at least a portion of the inner surface to vitrify. In certain embodiments the heat source is configured to heat at one time a relatively small area of the inner surface, and the apparatus comprises a positioning mechanism for moving the heat source with respect to the inner surface. In certain embodiments the heat source is a hydrogen-oxygen surface-mix fueled torch that is moved helically with respect to the inner surface of the body under the control of a programmed CNC motion control system.

Apparatus for producing a vitreous inner layer on a fused silica body, and method of operating same

A fused silica body comprising a layer of vitreous silica adjacent at least a portion of an inner surface is described in embodiments herein. In other embodiments, a method of making a fused silica body with a layer of vitreous silica adjacent at least a portion of an inner surface is described herein, comprising heating at least a portion of the inner surface to the point of vitrification. In certain embodiments, the method involves passing a linear local heat source over the inner surface in a particular manner, such as a helical fashion transverse to the linear shape, and may involve creating on the inner surface of the body overlapping swaths of temporarily melted silica material.

Fused silica body with vitreous silica inner layer, and method for making same

Fused silica body with vitreous silica inner layer and method for making the same

Growing community of inventors

Dallas, TX, United States of America

Allen L Kelly