International Business Machines Corporation

Allen H Hopkins

John Joseph Konrad

Ralph A Barrese

Timothy Leroy Wells

Gary Gajdorus

Robert C Schaffer

David A Space, Jr

Donald L Putman

An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.

Selective shield/material flow mechanism

An apparatus for preventing drag-out is provided. The apparatus is arranged at an exit where a workpiece leaves a plating chamber. Brush members are arranged to contact both sides of the workpiece as it leaves the plating chamber. The brush members are adjustably arranged in a housing such that the angle of the brush member relative to the workpiece can be varied. A locking mechanism is provided to hold the brush member at a selected angle. The entire apparatus is adjustably inward and outward with respect to the workpiece as well as with respect to the plating chamber.

Apparatus for preventing drag-out

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Barton, NY, United States of America

Allen H Hopkins