Agilent Technologies, Inc.

Allen Chien

Frank Sigming Geefay

Qing Gan

Cheol Hyun Han

A method and apparatus for determining the hermeticity of a semiconductor package is disclosed. Gas is introduced into the semiconductor package during packaging. Vacuum suction is then applied to the package. If the package has any leaks, the gas within will escape. The package is next scanned using a spectrometer. If the spectrometer does not detect any gas within the package cavity, the package is not hermetically sealed. In an alternate embodiment, the device is packaged first, and then immersed in a pressurized liquid. If the package has a leak, the pressure on the liquid will force liquid into the package cavity. The cavity of a properly sealed package will remain empty and dry. The package is scanned using a spectrometer. If the spectrometer detects liquid within the package, the package is not hermetically sealed.

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San Ramon, CA, United States of America

Allen Chien