Molex Corporation

Interconnect Systems, Inc.

Allan Cantle

Augusto P Panella

John W Comish, Jr

Ray Matyka

Mark Gilliam

Prashant Joshi

Patrick Weber

A reconfigurable server includes improved bandwidth connection to adjacent servers and allows for improved access to near-memory storage and for an improved ability to provision resources for an adjacent server. The server includes processor array and a near-memory accelerator module that includes near-memory and the near-memory accelerator module helps provide sufficient bandwidth between the processor array and near-memory. A hardware plane module can be used to provide additional bandwidth and interconnectivity between adjacent servers and/or adjacent switches.

Reconfigurable server and server rack with same

Solid state memory modules are disclosed having increased density for module size/footprint. Different embodiments also provide for improved interconnect arrangements between the memory modules and the corresponding field programmable gate array (FPGA), micro-processor (&#x3bc;P), or application-specific integrated circuit (ASIC). These interconnects provide for greater module interconnect flexibility, operating speed and operating efficiency. Some memory module embodiments according to the present invention comprises a plurality of solid state memory devices arranged on a first printed circuit board. A second printed circuit board is on and electrically connected to the first printed circuit board, with the second printed circuit board having a pin-out for direct coupling to a host device.

High density memory modules

Growing community of inventors

Westlake Village, CA, United States of America

Allan Cantle