University of Massachusetts

Raytheon Company

Triton Systems, Inc.

Alkim Akyurtlu

Craig A Armiento

Oshadha K Ranasingha

Edward D Kingsley

Mary K Herndon

Thomas V Sikina

Mahdi Haghzadeh

Yuri A Piro

Andrew M Luce

James E Benedict

Andrew R Southworth

Kevin Wilder

Erika Klek

John P Haven

Kenneth A Marx

Joey L Mead

Carol M F Barry

Artee Panwar

Keith Higginson

Kyle M Homan

Adil-Gerai Kussow

Nantakan Wongkasem

Carolyn R Reistad

Christopher R Areias

Emily Lamport

Christopher N Kuncho

Alexander Z Senckowski

David Musoke

Cameron Hardie

Kevin M Wilder

Erika C Klek

An ink stabilizing composition includes a polymeric network including an acrylate polymer and a plurality of high aspect ratio particles each having an aspect ratio of about 2:1 to about 30:1 and an average particle diameter of about 0.5 to about 1.2 micrometers.

Temperature-stabilization of convertible functional inks by disruption of conduction paths

A position tracking system includes a member extending along a lengthwise axis. Multiple position tracking elements (such as conductive strips) are fabricated to be exposed on a surface of the member. The multiple position tracking elements form a sequence along the lengthwise axis and are spaced apart from each other. The position tracking system further includes a probe. The probe monitors for presences and absence of the position tracking elements disposed in the sequence as the member and corresponding sequence of position tracking elements moves with respect to the probe. Based on the detected presence and absence of position tracking elements, a monitor resource of the position tracking system monitors parameters such as: i) a position of the member along the axis, ii) a rate of movement of the member along the axis over time, iii) a direction of movement of the member along the axis, etc.

Electronic position sensing system, method, and apparatus

A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.

Nanocomposite material for ultraviolet curable direct write semiconductor applications

Among other concepts, this disclosure describes a thermal/optical/electronic authentication system (covert or non-covert) for device/system implementations. The authentication system may be based on different design parameters such as i) materials composition, ii) thickness of material, iii) geometry of material, iv) external effects including use of an external DC bias and curing, etc. The authentication testbeds can be configured to include one or more inks. Using such methods as discussed herein, the authentication can be broadened to include near-IR (700-900 nm), short wave IR (1-2.6 mm), and UVA (300-400 nm) or any spectrum. Printed resistors are very difficult to duplicate without Ag-BST13 ink. If necessary, a printed resistor network on a respective substrate can be hidden using a layer of non-sintered Ag-BST13 (non-conductive).

Multi-level authentication using different materials

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250&#xb0; C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.

Thick film resistors having customizable resistances and methods of manufacture

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250&#xb0; C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.

Flexible substrates including a polymer selected from a thermoplastic polymer, a thermoset polymer, and/or a polymer blend, and ferroelectric perovskite-type oxide particles dispersed in the polymer, where the ferroelectric perovskite-type oxide has a dielectric constant that varies with applied voltage. The flexible substrates can be used in tunable electronics.

Flexible functionalized ceramic-polymer based substrates

A printed electrical connector design includes two flat patterned thermoplastic plates printed with mechanical registration features that align conductive traces on the two plates of the electrical connector. A top plate is printed with a plurality of raised pedestals and a plurality of metallic traces. A bottom plate is printed with a plurality of recessed channels and a corresponding plurality of metallic traces. The plurality of recessed channels of the bottom plate are configured to mate with the plurality of raised pedestals on the top plate. The pedestals and channels of the top and bottom plates, respectively, serve to align the metallic traces that comprise the electrical connector. The printed electrical connector design allows printed electrical/electronic circuits and/or devices to be manufactured and interfaced with other printed electrical/electronic circuits and/or devices.

Electrical connectors, circuit boards, and fabrication techniques

A novel ferroelectric ink comprising multiphase Barium Strontium Titanate (BST) in a polymer composite is described. The ink can be employed using direct-ink writing techniques to print high dielectric constant, low loss, and electrostatically-tunable dielectrics on substrates. The substrates can be flexible such as plastics or rigid, such as substrates comprising semiconductor materials or ceramics and the like. The dielectric ink is made by suspending pre-sintered nano/submicron-sized particles of BST in a thermoplastic polymer with a solvent. After printing with the ink, a low temperature curing process is performed at temperatures below 200&#xb0; C., a temperature too low to sinter BST. Fully printed devices, such as a varactor and a phase shifter using direct ink writing methodologies are described.

Ferroelectric nanocomposite based dielectric inks for reconfigurable RF and microwave applications

Systems and methods described herein are provided for electrically coupling conductors within a multilayered printed circuit board (PCB) using an interconnect formed along an outer surface of one or more stripline boards making up the multilayered PCB. The multilayered PCB may include first and second stripline boards each having multiple dielectric layers. A first conductor may be formed in the first stripline between the multiple dielectric layers and a second conductor may be formed in the second stripline between the multiple dielectric layers. The interconnect may be formed over an outer surface the dielectric layers such that the interconnect extends from the first conductor to the second conductor. An electrically conductive wall may be formed over the edge or side portion of the dielectric layers to form a cavity that encloses the interconnect and the outer surface of the multilayered PCB.

Interconnection system for a multilayered radio frequency circuit and method of fabrication

Embodiments of the invention described herein include metamaterials that exhibit negative permittivity and negative permeability at optical frequencies, methods for preparing such materials, and devices prepared from same.

Negative refractive index materials and methods for making same

A metamaterial includes a dielectric substrate and an array of discrete resonators at the dielectric substrate, wherein each of the discrete resonators has a shape that is independently selected from: an F-type shape; an E-type shape; or a y-type shape. A parameter of a chiral metamaterial is determined and a chiral metamaterial having such a parameter is prepared by the use of a model of the chiral metamaterial. The metamaterial model includes an array of discrete resonators. In one embodiment, each of the discrete resonators has a shape that is independently selected from the group consisting of: an F-type shape; an E-type shape; and a y-type shape. To the metamaterial model, electromagnetic (EM) radiation, preferably plane-polarized EM radiation in a visible, ultraviolet or near-infrared region, having at least one wavelength that is larger than the largest dimension of at least resonator of the metamaterial model, is applied. Varying at least one characteristic of the metamaterial model and/or at least one wavelength of the applied EM radiation modulates EM interaction of the applied EM radiation with the metamaterial model, thereby determining a parameter of the chiral metamaterial. By the use of a model of the chiral metamaterial, a number of discrete resonators of a chiral metamaterial that are arrayed in a direction perpendicular to a propagation axis of EM radiation is also determined.

Growing community of inventors

Arlington, MA, United States of America

Alkim Akyurtlu