Robert Boschgmbh

Aline Welter

Christoph Gmelin

Peter Zweigle

Alexander Lux

Eckart Schellkes

Reinhold Herrmann

Helmut Deringer

Uwe Katzenwadel

Franco Zeleny

Jens Vollert

Bernd-Guenter Sippel

Vincent Barnstorff

Harun Bueyuekgoez

Peter Hajdu

Michael Lenz

Georg Eifler

Nadja Wolfangel

Mario Leschik

Gerald Baetzel

In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible.

Sensor module for accommodating a pressure sensor chip and for installation into a sensor housing

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Eisenach, Germany

Aline Welter