Intel Corporation

Alin Ila

Bassam Mohammed Ziadeh

Xiaoqing Ma

Robert R Martinson

Nathan P Heckathorne

Santosh Pabba

Mehdi Imaninejad

Mandy Mistkawi

Kevin Pounds

John Lofgren

Described herein are pick and place devices having reconfigurable nozzle subassemblies, as well as related devices and methods. In some embodiments, a pick and place device may have a reusable base plate, and a plurality of reusable vacuum nozzle subassemblies that are removably coupled to the base plate in a first configuration. In some embodiments, plurality of vacuum nozzle subassemblies may be removed, then removably re-coupled to the base plate in a second configuration. In some embodiments, a pick and place device may include a base plate, a plurality of nozzle subassemblies removably attached to the base plate, where individual nozzle subassemblies include a vacuum nozzle, a vacuum connection, and a base; and a top plate coupled to the base plate, where the top plate includes a plurality of openings configured to seat the plurality of nozzle subassemblies.

Pick and place tooling with adjustable nozzle configuration

A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.

Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packaging

Disclosed is an electrical connector assembly. The electrical connector assembly comprises a land grid array socket and the pick-and-placed (PnP) cap. The land grid array socket comprises a socket body and a loading mechanism. The PnP cap is removably attached to the peripheral edge of the socket body for covering a first surface of the socket body. The loading mechanism comprising a loading plate is mounted over the socket body and the PnP cap. The PnP cap detachably engages the loading plate, when the loading plate is mounted over the PnP cap.

Pick-and-place cap for land grid array socket

Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.

Growing community of inventors

Phoenix, AZ, United States of America

Alin Ila