Nano Dimension Technologies, Ltd.

Alik Belitzky

The disclosure relates to systems, methods and compositions for fabricating additive manufactured electronics having conductive and dielectric constituents comprising voids, using additive manufacturing. Specifically, the disclosure is directed to the fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.

Support ink compositions and methods of use thereof in additive manufacturing systems

The disclosure relates to systems, methods and compositions for fabricating composite component using additive manufacturing (AM). Specifically, the disclosure is directed to methods, systems and compositions for the fabrication of composite components having improved or modulated thermo-mechanical properties, as well as derivative dielectric strength, using for example, inkjet printing.

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Rehovot, Israel

Alik Belitzky