Facebook Technologies, LLC

Meta Platforms Technologies, LLC

Ali Sengül

Daniel Brodoceanu

Oscar Torrents Abad

Zheng Sung Chio

Jeb Wu

Pooya Saketi

Tennyson Nguty

Allan Pourchet

Chao Kai Tung

Remi Alain Delille

Nicholas Roy Corson

Thomas John Farrell Wallin

Robert Manson

Leif-Erik Sharif Simonsen

Katherine Healy

Sharon Nanette Farrens

Yigit Menguc

Yigit Mengue

Tennyson Nquty

Sharon Nannette Farrens

A pick-up head picks up a semiconductor device from a carrier substrate. The pick-up head includes a first leg portion, a second leg portion, a raised bridge base portion between the first and second leg portions, and a tip portion mounted on the raised bridge base portion. The tip portion engages with the semiconductor device to pick up the semiconductor device from the carrier substrate. The pick-up head is associated with a force detection mechanism that detects a force applied to the pick-up head for picking up the semiconductor device. The force detection mechanism includes cavities formed on the first leg portion and/or second leg portion, pillars arranged on the pick-up head, a force detection device arranged in a mount assembly that is attached on the pick-up head, or electrodes arranged on the mount assembly. Actuation of the pick-up head is determined based on the detected force.

Detection of force applied by pick-up tool for transferring semiconductor devices

The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be &#x3bc;LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

A pick-up tool (PUT) includes a bridge pick-up head. The bridge pick-up head includes: a first bridge leg portion, a second bridge leg portion, and a bridge center portion between the first and second leg portions, the first and second bridge leg portions each including a top surface and side surfaces, the top surfaces of the first and second bridge leg portions extending above the bridge center portion; a bridge base portion on the bridge center portion, the bridge base portion including a bottom side on the bridge center portion, a top side that is smaller than the bottom side, and one or more sloped surfaces defined between the top and bottom sides; and a tip configured to attach with a semiconductor device on the top side of the bridge base portion.

Bridge pick-up head for transferring semiconductor devices

Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers

Curing pre-applied and plasma-etched underfill via a laser

Embodiments relate to using nanoporous metal tips to establish connections between a first body and a second body. The first body is positioned relative to the second body to align contacts protruding from a first surface of the first body with electrodes protruding from a second surface of the second body. The second surface faces the first surface. The contacts, the electrodes, or both comprise nanoporous metal tips. A relative movement is made between the first body and the second body after positioning the first body to approach the first body to the second body. The contacts and the electrodes are bonded by melting and solidifying the nanoporous metal tips after approaching the first body and the second body.

Hybrid interconnect for laser bonding using nanoporous metal tips

A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.

Interconnect with nanotube fitting

Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers

Embodiments relate to the design of an electronic device capable having flexible interconnects that connect together a first body and a second body of the electronic device. The flexible interconnects allow the electrical device to better withstand thermal-mechanical stress during fabrication of the electronic device and user usage of the electronic device.

Flexible interconnect using conductive adhesive

A pick-up head assembly comprises a body of a liquid crystalline elastomer (LCE) that undergoes a reversible expansion when exposed to a first frequency of light and contracts when exposed to a second frequency of light. Selective portions of the LCE in the pick-up head assembly are irradiated with the first frequency to cause an expansion in the selective portions. The adhesive forces of the expanded portions of the LCE are used to pick-up semiconductor devices from a first substrate. The semiconductor devices are placed on a second substrate by exposing the expanded portions of the LCE to the second frequency of light, causing the expanded portions to contract.

Liquid crystalline elastomer for pick and place of semiconductor devices

A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via magnetized interconnects. The backplane substrate may include circuits for driving the LED array, and each of the magnetized interconnects electrically connect a LED device to a corresponding circuit of the backplane substrate. The magnetized interconnects may be formed by electrically connecting first structures protruding from the backplane substrate to second structures protruding from the LED substrate. At least one of the first structure and the second structure includes ferromagnetic material configured to secure the first structure to the second structure.

Magnetic clamping interconnects

A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes one or more dummy electrodes that corresponds to one or more contacts on the substrate. The one or more dummy electrodes are exposed to a laser beam for coupling the one or more dummy electrodes to the one or more contacts. The one or more dummy electrodes may be positioned along edges of the LED chip that surround a display area of the LED chip and provide bonding strength between the LED chip and the substrate.

Bonding dummy electrodes of light emitting diode chip to substrate

A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.

Bonding corners of light emitting diode chip to substrate using laser

A light-emitting diode (LED) array is formed by bonding an LED chip or wafer to a backplane substrate via curved interconnects. The backplane substrate may include circuits for driving the LED's. One or more curved interconnects are formed on the backplane substrate. A curved interconnect may be electrically connected to a corresponding circuit of the backplane substrate, and may include at least a portion with curvature. The LED chip or wafer may include one or more LED devices. Each LED device may have one or more electrical contacts. The LED chip or wafer is positioned above the backplane substrate to spatially align electrical contacts of the LED devices with the curved interconnects on the backplane substrate. The electrical contacts are bonded to the curved interconnects to electrically connect the LED devices to corresponding circuits of the backplane substrate.

Growing community of inventors

Zurich, Switzerland

Ali Sengül