Kulicke and Soffa Industries, Inc.

Other

Ali R Safabakhsh

Vincent G Amorosi

A pick-up tool or pick-up head is provided for picking up semiconductor objects. The active face of the pick-up tool is provided with an outer plenum which extends around the peripheral edges of the object to be picked up and further includes an inner plenum formed in the center of the pick-up tool over the object to be picked up. A partial vacuum is applied to the inner plenum and compressed air is supplied to the outer plenum which flows over a support ridge separating the inner plenum from the outer plenum. The air flowing over the ridge generates a thin air film supporting layer so that the object being picked up by the pick-up tool is supported on the air film and levitated separate and apart from the pick-up tool.

Non-contact pick-up head

A die ejector chuck is provided with a central housing and an outer housing and the central housing is provided with a die eject collar which extends through an aperture in the outer housing. A preselected die on a flexible adhesive tape is positioned over the die eject collar and a source of vacuum is applied to apertures in the outer housing. The outer housing is moved upward and away from the central die eject collar so as to stretch the flexible adhesive tape by a die eject pin to permt the preselected die to be picked up with a die collet acting with a light pulling force on the active surface of the preselected die.

Pre-peel die ejector apparatus

A die ejector chuck is provided with a central housing and an outer housing and the central housing is provided with a die eject collar which extends through an aperture in the outer housing. A preselected die on a flexible adhesive tape is positioned over the die eject collar and a source of vacuum is applied to apertures in the outer housing. The outer housing is moved upward and away from the central die eject collar so as to stretch the flexible adhesive tape supporting the preselected die. The adhesive tape is pre-peeled and pulled away from the preselected die which subsequently is further separated from the adhesive tape by a die eject pin to permit the preselected die to be picked up with a die collet acting with a light pulling force on the active surface of the preselected die.

Growing community of inventors

Lafayette Hills, PA, United States of America

Ali R Safabakhsh