International Business Machines Corporation

Globalfoundries Inc.

Intel Corporation

Stmicroelectronics Gmbh

Commissariat a L'energie Atomique Et Aux Energies Alternatives

Renesas Electronics Corporation

Adeia Semiconductor Bonding Technologies Inc.

Sk Hynix Nand Product Solutions Corp.

Globalfoundries U.S. 2 LLC

Intel Ndtm US LLC

International Business Corporation

Elpis Technologies Inc.

Ali Khakifirooz

Kangguo Cheng

Alexander Reznicek

Bruce Bennett Doris

Pouya Hashemi

Ghavam G Shahidi

Thomas N Adam

Pranita Kulkarni

Veeraraghavan S Basker

Ruilong Xie

Xiuyu Cai

Davood Shahrjerdi

Kern Rim

Pranita Kerber

Bahman Hekmatshoartabari

Hong He

Balasubramanian S Haran

Tenko Yamashita

Shom Ponoth

Stephen W Bedell

Juntao Li

Dominic Joseph Schepis

Devendra K Sadana

Tak H Ning

Ramachandra Divakaruni

Ajey Poovannummoottil Jacob

Theodorus E Standaert

Charles W Koburger, Iii

Wilfried Haensch

Qing Liu

Reinaldo Ariel Vega

Robert H Dennard

John Albrecht Ott

Soon-Cheon Seo

Khaled Ahmed

Pranav Kalavade

Jin Cai

Johnathan E Faltermeier

Chun-chen Yeh

Maud Vinet

Junli Wang

Terence B Hook

Nicolas J Loubet

Shogo Mochizuki

Christian Lavoie

Herbert Lei Ho

Steven J Bentley

Yunpeng Yin

Edward J Nowak

Kevin K Chan

Hemanth Jagannathan

Arvind Kumar

Matthew Earl Colburn

Ravikumar Ramachandran

John Edward Barth, Jr

Henry K Utomo

Anirban Basu

Steven J Holmes

Xiang Yang

Kenneth Parker Rodbell

Joel Pereira De Souza

Subramanian Srikanteswara Iyer

Martin Michael Frank

Richard Stephan Wise

Scott D Luning

Chang Wan Ha

Byeong Yeol Kim

Chih-Chao Yang

David V Horak

Karthik Balakrishnan

Keith E Fogel

Ali Afzali-Ardakani

Jed Hickory Rankin

Balasubramanian Pranatharthiharan

Qizhi Liu

Ying Di Zhang

Isaac Lauer

Geng Wang

Chengwen Pei

Marc Adam Bergendahl

Babar Ali Khan

Sufi Zafar

Huiming Bu

Joshua M Rubin

Chun-Chen Yeh

Roger Allen Booth, Jr

Paul Charles Jamison

Richmond Hicks

Carl John Radens

Dharmendra S Modha

Katherine Lynn Saenger

Jeng-Bang Yau

Krishna Kumar Parat

Sanjay C Mehta

Prashant Majhi

Dirk Pfeiffer

Brian Joseph Greene

Robert C Wong

Vamsi Krishna Paruchuri

Donald Francis Canaperi

At the end of or after a reading operation in a 3D (three dimensional) NAND array, the wordlines of the 3D NAND array can be transitioned to ground in a staggered manner. The 3D NAND array includes a 3D stack with multiple wordlines vertically stacked, including a bottom-most wordline, a top-most wordline, and middle wordlines between the bottom-most wordline and the top-most wordline. A controller that controls the reading can set the multiple wordlines to a high voltage at the end or after the reading operation and then transition a selected wordline of the multiple wordlines from the high voltage to ground prior to transitioning the other wordlines to ground. Thus, the controller will transition the other wordlines from the high voltage to ground after a delay.

Staggered read recovery for improved read window budget in a three dimensional (3D) NAND memory array

Systems, apparatuses and methods may provide for memory controller technology including first logic to trigger, via an initial request, a hard-read and a soft-read, wherein the hard-read is to generate hard-bit information and the soft-read is to generate first soft-bit information and second soft-bit information, conduct a first error correction on the hard-bit information, and issue a subsequent request for at least the second soft-bit information if the first error correction is unsuccessful. Additionally, memory device technology may include a plurality of memory cells and second logic to conduct the hard-read and the soft-read from a memory cell in the plurality of memory cells in response to the initial request, send the hard-bit information to the controller, and withhold at least the second soft-bit information from the controller until the subsequent request is received.

Soft read operations with progressive data output

Systems, apparatuses and methods may provide for technology that boosts strings of a plurality of NAND sub-blocks to a pass voltage, deboosts a first subset of the boosted strings based on data associated with the plurality of NAND sub-blocks, and simultaneously programs the first subset while a second subset of the boosted strings remain at the pass voltage. In one example, to boost the strings of the NAND sub-blocks, the technology applies the pass voltage to selected and unselected wordlines that are connected to the NAND sub-blocks while selected and unselected strings are disconnected from a bitline that receives the data associated with the NAND sub-blocks.

Simultaneous programming of multiple sub-blocks in NAND memory structures

Dynamic program caching reduces latency of a program operation on multi-level cell (MLC) memory having at least three pages and programmable with multiple threshold voltage levels, such as a Triple Level Cell (TLC) NAND. A controller determines that the program operation can be initiated without loading all pages into the memory. In response, the NAND loads a first page and then executes portions of the program operation in parallel, at least in part, with loading subsequent pages. The NAND behavior is modified to monitor data loading completion times, to copy pages from a cache register to a data register as needed, and to resume program operation if a shutdown occurs. The portions of the program operation include a program prologue operation and a pulse verify loop for the first voltage level (L1) of the MLC memory.

Dynamic program caching

A method, a memory chip controller of a flash memory device, and a flash memory device. The memory chip controller includes processing circuitry to receive data for a first page of N pages of data; and program cells of a memory location of the device to an nth threshold voltage level Ln, Ln corresponding to a program verify voltage level PVn, n being an integer from 0 to 2−1, and Ln being one of 2threshold voltage levels achievable using the N pages of data. Programming the cells includes: programming the cells based on the data for the first page while receiving data for subsequent pages of the N pages; and programming the cells based on the data for the subsequent pages, wherein programming the cells includes, for at least n=1, causing a respective dynamic start voltage (DSV) to be applied to the cells based on each respective page number p of the N pages for which data is received at the memory chip controller for the memory location to achieve PV

Cache processes with adaptive dynamic start voltage calculation for memory devices

Systems, apparatuses and methods may provide for technology that applies a first set of control signals to even bitlines in NAND memory and senses voltage levels of the even bitlines during an even sensing time period. The technology may also apply a second set of control signals to odd bitlines in the NAND memory, and sense voltage levels of the odd bitlines during an odd sensing time period, wherein the second set of control signals are applied after expiration of a stagger time period between the even sensing time period and the odd sensing time period.

Staggered active bitline sensing

An apparatus is described. The apparatus includes a memory chip having logic circuitry to suspend application of an erasure voltage, wherein, respective responses of the erasure voltage to a decision to suspend the application of the erasure voltage depend on where the erasure voltage is along its waveform.

Solid state drive (SSD) with in-flight erasure iteration suspension

Error correction coding (ECC) mis-corrected reads, if undetected, result in silent data corruption of a non-volatile memory device. Overcoming ECC mis-corrected reads is based on a read signature of a result of reading a page in the non-volatile memory device. An ECC mis-correct logic counts the number of bits in the end-most buckets into which the bits of the result is divided. End-most buckets that are overpopulated or starved reveal a tell-tale read signature of an ECC mis-correct. The ECC mis-correct is likely to occur when the read reference voltage level used to read the page is shifted in one direction or another to an extreme amount that risks reading data from a different page. Detecting ECC mis-corrected reads can be used to overcome the ECC mis-corrects and mitigate silent data corruption.

Overcoming error correction coding mis-corrects in non-volatile memory

A method of forming a fin structure that includes forming a plurality of fin structures from a bulk semiconductor substrate and forming a dielectric spacer on a sidewall of each fin structure in the plurality of fin structure. A semiconductor spacer is formed on a sidewall of the dielectric spacer. A dielectric fill is formed in the space between the adjacent fin structures. The semiconductor spacer and a portion of the fin structures that is present below a lower surface of the dielectric spacer are oxidized. Oxidizing a base portion of the fin structures produces a first strain and oxidizing the semiconductor spacer produces a second strain that is opposite the first strain.

Dielectric isolated fin with improved fin profile

An apparatus comprises a plurality of memory cells; a plurality of sense circuits, a sense circuit comprising a sense node selectively coupled to a bitline coupled to a first cell of the plurality of memory cells; and a controller to transpose a value indicative of a voltage of the first cell to the sense node; isolate the sense node from the bitline; and calibrate a parameter for the sense circuit based on outputs of the sense circuit for each of a plurality of different applied values of the parameter.

Automatic read calibration operations

Micro light-emitting diode displays and methods of fabricating micro LED displays are described. In an example, a micro light emitting diode pixel structure includes a plurality of micro light emitting diode devices in a dielectric layer. A transparent conducting oxide layer is above the dielectric layer. A color conversion device (CCD) is above the transparent conducting oxide layer and over one of the plurality of micro light emitting diode devices.

Micro light-emitting diode displays having color conversion devices and assembly approaches

Examples herein relate to determining a number of defective bit lines in a memory region prior to applying a program or erase voltages. If a threshold number of bit lines that pass during a program or erase verify operation is used to determine if the program or erase operation passes or fails, the determined number of defective bit lines can be used to adjust the determined number of passes or fails. In some cases, examples described herein can avoid use of extra bit lines and look-up table circuitry to use in place of defective bit lines and save silicon space and cost associated with the use of extra bit-lines. In some examples, a starting magnitude of a program voltage signal can be determined by considering a number of defective bit lines.

Defective bit line management in connection with a memory access

A semiconductor structure capable of real-time spatial sensing of nanoparticles within a nanofluid is provided. The structure includes an array of gate structures. An interlevel dielectric material surrounds the array of gate structures. A vertical inlet channel is located within a portion of the interlevel dielectric material and on one side of the array of gate structures. A vertical outlet channel is located within another portion of the interlevel dielectric material and on another side of the array of gate structures. A horizontal channel that functions as a back gate is in fluid communication with the vertical inlet and outlet channels, and is located beneath the array of gate structures. A back gate dielectric material portion lines exposed surfaces within the vertical inlet channel, the vertical outlet channel and the horizontal channel.

Nanofluid sensor with real-time spatial sensing

An array of semiconductor fins is formed on a top surface of a substrate. A dielectric material liner is formed on the surfaces of the array of semiconductor fins. A photoresist layer is applied and patterned such that sidewalls of an opening in the photoresist layer are parallel to the lengthwise direction of the semiconductor fins, and are asymmetrically laterally offset from a lengthwise direction passing through the center of mass of a semiconductor fin to be subsequently removed. An angled ion implantation is performed to convert a top portion of dielectric material liner into a compound material portion. The compound material portion is removed selective to the remaining dielectric material liner, and the physically exposed semiconductor fin can be removed by an etch or converted into a dielectric material portion by a conversion process. The dielectric material liner can be removed after removal of the semiconductor fin.

Selective removal of semiconductor fins

Embodiments of the present disclosure describe light emitting displays having a light emitter layer that includes an array of light emitters and a wafer having a driving circuit coupled with the light emitter layer, computing devices incorporating the light emitting displays, methods for formation of the light emitting displays, and associated configurations. A light emitting display may include a light emitter layer that includes an array of light emitters and a wafer coupled with the light emitter layer, where the wafer includes a driving circuit formed thereon to drive the light emitters. Other embodiments may be described and/or claimed.

Light emitting display

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Los Altos, CA, United States of America

Ali Khakifirooz