Sun Microsystems, Inc.

Advanced Micro Devices Corporation

Ali Hassanzadeh

Stephen F Heng

Mahesh S Hardikar

Sanjay Dandia

Michael C Freda

Victor Odisho

Larry D Smith

Istvan Novak

Han Y Ko

Hassan Sihpolo

Srikumar Seshasayee

Socket assembly

Socket housing

Socket cover cap

Socket frame

A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide power to the integrated circuit. The PCB may include a signal layer for conveying signals to and from the integrated circuit, but does not include any means for providing core power to the integrated circuit. Thus, all core power provided to the integrated circuit may be supplied by the power laminate.

Method and apparatus for distributing power to integrated circuits

A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide core power to the integrated circuit. The power laminate may also include a voltage regulator circuit, and a plurality of decoupling capacitors. In one embodiment, the power laminate may include a plurality of apertures which allow for the passing of connections between the integrated circuit and the PCB. The integrated circuit may be mounted to the PCB by solder balls of a ball-grid array, elestomeric connections of a land-grid array, or other type of mounting. The each of the solder balls or elastomeric connections may pass though one of the apertures of the power laminate.

Power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages

An apparatus and system comprising electrical interconnection devices (EIDs), such as printed wiring boards, semiconductor packages, and printed circuit boards, having novel via and signal trace positioning. The vias may be positioned off-center from the pattern of the surface pads. Via groups, or staircase vias, connect surface pads with vias extending into the electrical interconnection device. The via groups convert the pad geometry on the surface to a more open via pattern on one or more internal layers. The EID comprises a plurality of pads formed on a surface for providing electrical connections to another EID. A plurality of vias each extend from a corresponding pad to another layer of the printed wiring board. Each via is offset from a central location of its corresponding pad. A via group comprises a plurality of vias with a first via connecting a surface of the electrical interconnection device to a first inner layer electrically connects a pad on a surface of the electrical interconnection device to a second via. The second via extends from the first inner layer to a second layer of the electrical interconnection device. The centers of the first via and the second via are non-collinear. Another EID includes a uniformly spaced set of pads on the surface. Via groups, comprising a first set of vias and a second set of vias, extend from the uniformly spaced surface pads. Spacing among the second set of vias is non-uniform.

Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging

A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating s space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is flirter disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB. A second notch is positioned between the second end of the PCB and the center of the PCB. A distance between the first notch and the second notch is greater than 40% of the length of the PCB. The first notch may be farther from the first end of the PCB than from the center, and the second notch may be closer to the second end of the PCB than to the center.

Memory module with offset notches for improved insertion and stability and memory module connector

A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is further disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB. A second notch is positioned between the second end of the PCB and the center of the PCB. A distance between the first notch and the second notch is greater than 40% of the length of the PCB. The first notch may be farther from the first end of the PCB than from the center, and the second notch may be closer to the second end of the PCB than to the center.

A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is further disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing for stability of the memory module while encased by the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB. A second notch is positioned between the second end of the PCB and the center of the PCB. A distance between the first notch and the second notch is greater than 40% of the length of the PCB. The first notch may be farther from the first end of the PCB than from the center, and the second notch may be closer to the second end of the PCB than to the center.

A leaf type spring is used to hold a heat sink in contact with a chip or other heat-emitting component. Such a component may be mounted on a PCB or other element. A bolster plate is positioned below the PCB and two pins extend up from the bolster plate, through the PCB and through the base of a heat sink. A preferred heat sink has plural fins extending up from the base. In one form of the invention the pins extend above the level of the outer ends of the pins. A spring extends diagonally across the ends of the fins. Slots in the ends of the spring engage necks formed near the ends of the pins. In another form of the invention the fins are milled or otherwise formed with a groove extending diagonally across the heat sink and the spring fits into the slot. The pins extend only a short distance above the base of the heat sink and are necked to receive the slotted ends of the spring. In both forms of the invention intimate contact of the base with the heat emitting component improves heat transfer.

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Fremont, CA, United States of America

Ali Hassanzadeh