Nextinput, Inc.

Qorvo US, Inc.

Decawave Limited

Ali Foughi

Julius Minglin Tsai

Ryan Matthew Diestelhorst

Dan Benjamin

Christopher Edwards

Albert M Bergemont

Michael J Dueweke

Michael Dueweke

Bryan Low

Described herein are input structures that include an input surface and one or more sensor modules attached to the input surface. Each sensor module includes one or more sensors operably attached to a substrate. The one or more sensors are operable to detect strain on the substrate. One or more portions of the substrate are removed to produce a stress concentration region in proximity to at least one sensor. The stress concentration region concentrates strain in proximity to the at least one sensor.

Input structures that include slots that create a stress concentration region in a substrate for strain detection by a sensor

Described herein is a sensor in chip scale package form factor. For example, a non-vacuum packaged sensor chip described herein includes a substrate, and a sensing element arranged on the substrate. The sensing element is configured to change resistance with temperature. Additionally, the non-vacuum packaged sensor chip includes an absorbing layer configured to absorb middle infrared ('MIR') radiation.

Combined near and mid infrared sensor in a chip scale package

In one embodiment, a ruggedized wafer level microelectromechanical ('MEMS') force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.

Integrated digital force sensors and related methods of manufacture

Integrated systems for force or strain sensing and haptic feedback are described herein. An example force-haptic system can include a sensor chip configured to receive an applied force, where the sensor chip includes at least one sensing element and an integrated circuit. The force-haptic system can also include a haptic actuator configured to convert an electrical excitation signal into mechanical vibration. Further, the force-haptic system can include a circuit board, where the sensor chip and the haptic actuator are electrically and mechanically coupled to the circuit board. The integrated circuit can be configured to process an electrical signal received from the at least one sensing element and to output the electrical excitation signal.

Integrated systems with force or strain sensing and haptic feedback

In one embodiment, a ruggedized wafer level microelectromechanical ('MEMS') force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor ('CMOS') circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.

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Atherton, CA, United States of America

Ali Foughi