Amazon Technologies, Inc.

Ali Elashri

Nafea Bshara

Luke Thomas Gregory

Ryan F Conroy

Ziv Harel

Priti Choudhary

Noah Thomas Kelly

Yotam Admon

Shay Madar

Darin Lee Frink

Rick Chun Kit Cheung

William Mark Megarity

Christopher Mario Gil

Kenny Kiet Huynh

Chetan Sanjay Agarwal

Ofer Katz

Munish Sharma

Noam Navon

A computer system includes a processor module comprising a vapor chamber heat spreader for removing heat from a bare die processor. The vapor chamber heat spreader may be coupled with the bare die processor via a mounting structure. The vapor chamber heat spreader may have a pedestal that extends towards the bare die processor, such that a bottom surface of the pedestal is positioned proximate a top surface of the bare die processor. In various embodiments, the processor module may be configured to enable servicing of one or more components. For example, the processor module may have a mechanism that allows for uncoupling the vapor chamber heat spreader from the bare die processor, so as to enable replacement of the bare die processor in some embodiments.

Vapor chamber heat spreader for bare die processors

Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.

Heat sinks for bare die multi-chip packages

A computer system includes a chassis comprising location indicating elements, such as springs, magnets, standoffs, or other types of location indicating elements physically attached to the chassis in a configuration that indicates locations in the chassis. Also, the computer system includes multiple printed circuit boards comprising pads configured to interface with the location indicating elements, wherein combinations of sensed or not sensed location indicating elements at the pads of the printed circuit boards provide a physically verified placement location for the printed circuit boards.

Board physical placement verification in a server chassis

A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger.

Processor heat exchanger with separate mounting structure

A computing equipment box assembly can include a chassis base and a tray. The chassis base can include a bottom panel, an opening through the bottom panel, and a rim defined around the opening. The tray can include a body configured for supporting computing components, a frame section of the body sized to be supported atop the rim of the chassis base; and a downwardly embossed portion of the body extending downwardly from the rim and sized to fit within the opening of the chassis base when the frame section is supported atop the rim of the chassis base.

Anti-sag modular server chassis assembly

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Seattle, WA, United States of America

Ali Elashri