Qualcomm Incorporated

Advanced Micro Devices Corporation

Ali Akbar Merrikh

Mehdi Saeidi

Rama Rao Goruganthu

Christopher M Jaggers

Samuel D Naffziger

Jon James Anderson

Ryan Donovan Wells

Martin Saint-Laurent

Jefferson Blake West

Rajit Chandra

Richard Alan Stewart

Matthew C Grossman

Ashish Jain

Paul G Hughes

Steven Frederick Liepe

Farsheed Mahmoudi

Madhu Saravana Sibi Govindan

Damion B Gastelum

Mohamed Waleed Allam

Melika Roshandell

Steve Capezza

Christopher Janak

David A McAfee

Mohammad Ghasemazar

Benjamin D Bates

Hans Lee Yeager

Christopher L Platt

Chris Janak

Guoping Xu

Ajay Vadakkepatt

Luis Eduardo De Los Heros Beunza

Evan Bentley Fleming

Nicholas Poteracki

Benjamin David Bates

Samuel David Naffziger

A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of wires of a second material. The second material may be different from the first material. In addition, the second set of wires may extend in a second direction different than the first direction of the first wires.

Thermopile mesh

A temperature sensor position offset error correction power implementation include monitors (e.g., digital power monitor/meter) to measure activity on a die, and uses the activity measurements to compute real-time temperature offsets by converting activity to power, which can be used in a simplified compact thermal model. A system on chip including the die receives a temperature measurement of a region of the system on chip from a sensor. Power consumed by the region is estimated based on the measured activity, and temperature measurement of the system on chip is adjusted based on the estimated power.

Temporal temperature sensor position offset error correction

Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating component and coupling a shroud to the heat sink. The shroud has a first opening to direct air in a first direction past the heat sink and a second opening to direct air in a second direction past the heat sink. Air is moved through the first opening or the second opening.

Modular thermal solution for high-performance processors

Aspects include computing devices, systems, and methods for managing a first computing device component of a computing device in order to extend an operating life of the computing device component. In an aspect, a processing device may determine a condition estimator of the first computing device component, determine whether the condition estimator of the first computing device component indicates that a condition of the first computing device component is worse than the condition of a second computing device component, and assign workloads to the first and second computing device components to balance deterioration of the condition of the first and second computing device components in response to determining that the condition estimator of the first computing device component indicates that the condition of the first computing device component is worse than the condition of the second computing device component.

Runtime optimization of multi-core system designs for increased operating life and maximized performance

Aspects of the disclosure are directed to a package including a substrate, die coupled to the substrate, wick deposited on the die, and an evaporation-condensation chamber having a hollowed bottom and two bottom lips, wherein the wick mates into the hollowed enclosure and substantially merges with the two bottom lips forming a sealed chamber. Other aspects are directed to a method of forming a package including coupling a die to a substrate, depositing a wick on the die, and mating the wick with an evaporation-condensation chamber having a hollowed enclosure and two bottom lips, wherein the mating attaches the wick into the hollowed enclosure and substantially merges the wick with the two bottom lips forming a sealed chamber. By directly depositing the wick over the die and integrating the wick with the encapsulation-condensation chamber, this integrated solution provides significant improvement in package thermal resistance especially for high-power and high-performance applications.

High performance evaporation-condensation thermal spreading chamber for compute packages

An apparatus is disclosed that comprises an integrated circuit and a thermal detector array configured to detect thermal radiation from the integrated circuit. A method is disclosed that comprises providing an integrated circuit and disposing a thermal detector array so as to detect thermal radiation from the integrated circuit. Another apparatus is disclosed that comprises means for processing and means for detecting thermal radiation from the means for processing.

Thermal detector array configured to detect thermal radiation from the integrated circuit

An apparatus and method of the disclosure provides a cooling mechanism for a handheld electronic device. The cooling mechanism includes a heat sink and an evaporative cooling mechanism. The evaporative cooling mechanism includes liquid retaining structures. The liquid retaining structures are located in proximity to the at least one IC of the handheld electronic device. Each liquid retaining structure is coated with a temperature sensitive polymer that act as hydrophilic when the temperature of the surface of the handheld electronic device is below a threshold temperature. To maintain the temperature of the surface of the handheld electronic device below the threshold temperature, the temperature sensitive polymer act as hydrophobic and evaporates the liquid stored in the liquid retaining structures to the atmosphere surrounding the handheld electronic device when the temperature of the surface of the electronic device is above the threshold temperature.

Evaporative cooling solution for handheld electronic devices

A method includes controlling a power limit of a computing system based on a determined skin temperature of at least one location on an outer surface of a device housing the computing system. A processor includes a processing unit and a power management controller to control a power limit of the processing unit based on a determined skin temperature of at least one location on an outer surface of a device housing the processor.

Power management to change power limits based on device skin temperature

Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.

Multi-compartment computing device with shared cooling device

Growing community of inventors

Austin, TX, United States of America

Ali Akbar Merrikh