International Business Machines Corporation

3m Innovative Properties Company

Alfred Viehbeck

Jane M Shaw

Jeffrey Curtis Hedrick

Stephen L Tisdale

Terrence Robert O'Toole

Martin J Goldberg

Konstantinos I Papathomas

David Andrew Lewis

Elizabeth F Foster

Sampath Purushothaman

Ali Afzali-ardakani

Niranjan Mohanlal Patel

Jeffrey T Gotro

Stephen L Buchwalter

George Frederick Walker

Kang-Wook Lee

Stanley Joseph Whitehair

Marie Angelopoulos

Ravi F Saraf

Vlasta A Brusic

Judith Marie Roldan

Teresita Ordonez Graham

Linda C Matthew

Voya Rista Markovich

Harry R Bickford

Janusz S Wilczynski

Donald G McBride

Rodney T Hodgson

Shahrokh Daijavad

Caroline A Kovac

Steven E Molis

Ashit A Mehta

Bodil E Braren

James L Hedrick, Jr

Evan Ezra Davidson

Peter J Duke

Juan Ayala-Esquilin

Eleftherios Adamopoulos

Kie Y Ahn

James L Hedrick

Gareth Geoffrey Hougham

John J Ritsko

Robert J Twieg

Jeffrey W Labadie

Jungihl Kim

Tae Seok Oh

William Joseph

Keith E Fogel

Robert Maynard Japp

Kostas I Papathomas

Daniel Peter Morris

Kurt R Grebe

Revathi Iyengar

Richard R Thomas

Eva Erika Simonyi

Mark J Schadt

Ernest R Frank

Thomas H Baum

Paul William Coteus

Jeffrey Donald Gelorme

Richard Joseph Gambino

Michael John Brady

Alphonsus V Pocius

Kam Leung Lee

Nicholas A Stacey

Leena Paivikki Buchwalter

Guoping Mao

Karl Hermann

Stephen Joseph Fuerniss

Mark F Bregman

Michael R Scheuermann

John B Scheibner

Walter P Pawlowski

John J Glenning

Nanayakkara L D Somasiri

Amarjit S Rai

Paige A Poore

Shyama P Mukherjee

Arthur E Graham

Joseph J Van Horn

Dennis A Canfield

Susan J LaMaire

Jer-Ming Yang

Thomas H Lewis

William A Donson

Yuk L Tsang

Bernard Krieger

Hany B Eitouni

Gary V Arbach

Alice F Tai

Clarence S Long

Timothy A Redmond

Gavin T Mills

Jeffrey A Haley

Kathleen S Ginn

Peter E Freiermuth

Martin Yonnone

William V Corso

A photoimageable, aqueous acid soluble polyimide polymer comprising an anhydride, including a substituted benzophenone nucleus, a diamine reacted with the anhydride to form a photosensitive polymer intermediate, and at least 60 Mole % of solubilizing amine reacted with the photosensitive polymer intermediate to form the photoimageable, aqueous acid soluble polyimide polymer. An emulsion for electrophoretic deposition of a coating of a photoimageable, aqueous acid soluble polyimide polymer comprises a dispersed phase, including the photoimageable aqueous acid soluble polyimide polymer, dissolved in an organic solvent and a dispersion phase including a coalescence promoter and water. The emulsion may be applied, by electrophoretic deposition, to a conductive structure to provide a photoimageable coating on the conductive structure. After exposing the coating to a pattern of radiation for photocrosslinking exposed parts of the photoimageable aqueous acid soluble polyimide polymer, an aqueous acid developer solution removes unexposed photoimageable aqueous acid soluble polyimide polymer to reveal a crosslinked polyimide polymer image of the radiation pattern.

Photoimageable, aqueous acid soluble polyimide polymers

Disclosed is a printed circuit board, and a method of preparing a printed circuit board, which possesses a coefficient of thermal expansion substantially similar to that of silicon for use in direct semiconductor chip attach structures and similar solder mounted devices. The printed circuit board is fabricated from prepreg having a thermosetting resin and a reinforcement layer consisting of non-woven aramid mat or a liquid crystalline polymer paper. The composite dielectric layer optionally includes plated through holes which are either filled or non-filled, and one or more thin film redistribution layers to provide high density electronic packages. The design places the solder pads at the PTHs where needed. The redistribution layer can be formed using photoimagable dielectrics or laminated controlled-CTE composites and laser via imaging.

High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer

A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The packgage allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.

Three dimensional package and architecture for high performance computer

A composition comprising a thermoset resin which may or may not contain fluorine, bromine or both and containing at least one bromine-containing homo- or multicomponent thermoplastic polymer modifier optionally containing a different halogen which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.

Homo-, co-  or multicomponent thermoplastic polymer dispersed in a thermoset resin

A microwave applicator that provides a substantially uniform microwave field distribution over a large area, includes an elongated chamber, preferably operating in the length independent mode. A microwave source generates a microwave field at an output frequency. A waveguide or coaxial cable directs the microwave field from the microwave source into the elongated chamber, either through a side launch, end launch or multi launch. A frequency of the microwave field in the elongated chamber and the output frequency of the microwave source are matched through the use of controlled feedback of critical material and process parameters.

Applicator to provide uniform electric and magnetic fields over a large

A microwave applicator includes an elongated chamber, preferably having a cylindrical shape, for processing materials therein. A waveguide, connected to the elongated chamber, couples microwave power into the elongated chamber. The cross-sectional area of the elongated chamber can be mechanically adjusted to control and maintain the microwave field uniformity and resonant mode, preferably the length independent mode TM.sub.010, during the processing of the material. The applicator can thus provide microwave energy having a substantially uniform field distribution over a large area for processing materials, for example, a web or sheet like product, plywood and pre-impregnated cloth, in a continuous manner.

Microwave applicator having a mechanical means for tuning

A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.

Composition containing a polymer and conductive filler and use thereof

Electrostatic discharge protection or electromagnetic interference shielding is provided by applying a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles and at least one conducting polymer to a dielectric substrate.

Method for providing discharge protection or shielding

A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.

Housing for electromagnetic interference shielding

A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.

A composite comprising a metal substrate and as a corrosion protecting layer on at least one major surface of said substrate, a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles.

Composite comprising a metal substrate and a corrosion protecting layer

Disclosed is an admixture which is curable to form a crack resistant, photosensitive polycyanurate resist. Also disclosed is a structure for its use and process of making. The resist can be tailored to be either positively or negatively sensitive to actinic radiation. Because of its improved thermal and mechanical properties, the cured resist is suitable for use at high temperature, such as in electronic packaging applications.

Toughened photosensitive polycyanurate resist, and structure made

Electrostatic discharge protection and electromagnetic interference shielding is provided by applying to a dielectric substrate a composition comprising a polymeric matrix and a conductive filler component. The conductive filler component comprises electrically conductive metal particles and at least one electrically conducting polymer.

Methods are described for fabricating devices having vias containing more than one electrical conductor, in particular coaxial electrical conductors. A plurality of wires are bonded to a first substrate, such as a copper wire to a copper substrate. A second substrate having through-holes with side walls covered with an electrical conductor is disposed over the first substrate so that the wires are within the through-holes and spaced apart from the side walls. The first substrate is spaced apart from the second substrate by dielectric spacers. A polymer is injected into the space between the first and second substrates to provide electrical isolation therebetween. A polymer is injected into the space in the via between the elongated conductors and the conductive sidewall to provide dielectric isolation therebetween. The second substrate has electrically conductive pattern on both sides which are electrically interconnected by the electrically conductive sidewall to form an inner coil of electrical conductors. The first substrate is patterned to form an electrical conductive pattern. A pattern of electrical conductors is formed on the dielectric material on the side of the second substrate opposite the patterned first substrate and is electrically connected therewith through the elongated conductors on the through-hole to form an outer coil of electrical conductors around the inner coil of electrical conductors to from a transformer or an inductor.

Methods of fabrication of coaxial vias and magnetic devices

A structure including a halogenated polymeric-containing layer. At least a portion of a surface of the halogenated polymeric-containing layer is electrochemically reduced. An electrically conductive pattern is provided over at least a portion of the electrochemically reduced portion of the halogenated polymeric-containing layer.

Structure including a partially electrochemically reduced halogenated

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Fishkill, NY, United States of America

Alfred Viehbeck