Ceramtec Gmbh

Hoechst Ceramtec Aktiengesellschaft

Geramtec Gmbh

Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Excelitas Technologies Elcos Gmbh

Alfred Thimm

Alexander Dohn

Klaus Herrmann

Roland Leneis

Siegmund Kobilke

Stefan Stolz

Jürgen Ruska

Roland Dilsch

Armin Veitl

Peter Besold

Stefan Greger

Sigurd Adler

Christian Schnagl

Karl Degelmann

Thomas Schreir-Alt

Ewald Sutor

Johannes Ernst

Katja Heumann

Kunibert Reiss

Kurt Braun

Michel Kazempoor

Harald Kress

Heinz Groschwitz

Gerhard Günthner

Axel Schöler

The invention relates to a module () in which voltages greater than 1,000 V and currents greater than 100 A are applied via supply lines, with an electrically insulating carrier (), with a connection means () which has a material thickness greater than 0.3 mm and is connected to the carrier () via a metallization area () which is delimited by a first end () and a second end (), with electronic components () which are connected to the connection means () as required, and with cooling means (). In order that the power is supplied from the outside via the connection means () directly to the module and thus the bonding processes that are customary in the prior art are omitted and parasitic inductances on the power supply are avoided, the invention proposes that the connection means () protrudes beyond one end () of the metallization area () at least at one point, is not fixed to the carrier () in this area () and has contact means ().

Module with connection lugs for supply lines

A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or AlO. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.

Method for producing multi-level metalization on a ceramic substrate

A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

Metal coating on ceramic substrates

A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

Method for metalizing vias

The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.

Ceramic printed circuit board comprising an al cooling body

A liquid-cooled heat sink includes a top plate having an array of circuitous liquid channels, each channel having a separate channel inlet and a common central outlet channel. The heat sink further includes a bottom plate having an inlet port and an outlet port. The heat sink further includes an intermediate plate having inlet guide channels providing fluid communication between the inlet port of the bottom plate and channel inlets of the top plate, said intermediate plate further including an outlet guide channel providing fluid communication between the common central outlet channel of the top plate and the outlet port of the bottom plate.

Homogeneous liquid cooling of LED array

The invention relates to molded functional bodies made of highly thermally conductive materials, namely aluminum nitride, to a method for the production thereof by way of extrusion, and to the use thereof.

Extruded molded functional body made of highly thermally conductive ceramic

In order to supply power and control the power supplied to an LED (), in particular an LED () comprising a ceramic support element (), an LED driver circuit () is designed to regulate the supply current for the LED () in accordance with the temperature of the support element ().

LED driver circuit

A non-conductive ceramic material contains a base ceramic material and at least one other ceramic material having a lower coefficient of thermal expansion than that of the base material so that the coefficient of thermal expansion of the non-conductive ceramic material is identical to that of a metallic material to which it will be matched. Methods of making and using same are disclosed.

Ceramic material with a composition which is matched to a coefficient of thermal expansion specified by a metallic material

Ceramic diode carriers () comprising a ceramic carrier body () integrally connected to ceramic cooling elements () dissipating heat, wherein sintered metallization regions () are disposed as conductors on the surface () of the carrier body (). LEDs () can be fastened to the diode carrier (), the electrical connections thereof being electrically connectable to the conductors. In order to produce luminous bodies from ceramic diode carriers (), at least two identical ceramic diode carriers () are connected into an array.

Array of scalable ceramic diode carriers with LEDs

The invention relates to a process for producing a metal-coated, metallized component of aluminum nitride ceramic in the steps:

Process for producing a metal-coated, metallized component of aluminum

A component of aluminum nitride metallized with a metallizing paste containing: (i) a pulverulent glass of the MnO--Al.sub.2 O.sub.3 --SiO.sub.2 system as an adhesion promotor having a mean particle size of 2-15 .mu.m; (ii) a refractory metal powder having a mean particle size of 1-4 .mu.m; and (iii) an organic resin dissolved in a suitable solvent and/or a screen printing oil is disclosed. The metallizing paste preferably has a viscosity of 50-100 Pa.multidot.s when applied by screen printing, and a viscosity of &lt;5 Pa.multidot.s when applied by dipping. The component of aluminum nitride metallized with the metallizing paste has at least one metal layer deposited on the metallizing paste, and the at least one metal layer applied has a bonding strength given by mean pull-off values of .gtoreq.3.5 kN/cm.sup.2.

A process for producing an electric heating element is disclosed whereby metallic heating conductors are embedded between ceramic insulating layers, and, as power supply leads and power outlet leads, contact recesses in the ceramic insulating layers are filled with an electrically conductive composition. The heating conductors, the power supply leads and the power outlet leads are applied to the ceramic layers in the green state as metallizing paste containing from 60 to 95% by weight of metal particles and from 5 to 40% by weight of inorganic powder, based on the total solids content of the paste. The ceramic layers with the applied metallizing pastes are then stacked on top of one another and then sintered.

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Wunsiedel, Germany

Alfred Thimm