Siemens Aktiengesellschaft

Simens Aktiengesellschaft

Alfred Pichler

Horst Pachonik

Winfried Berghof

Joachim Hertrampf

Kurt Plehnert

Gerhard Beil

Rainer Raeth

Method for manufacturing terminal contacts for thin-film magnetic heads. The method of manufacturing reinforced terminal contacts for thin-film magnetic heads provides a photolithographic process sequence that allows the technical requirements to be kept as low as possible and that reduces the gold consumption to a minimum. To that end, a copper layer for contact reinforcement fashioned as a tower is electrodeposited in contact windows formed by a photoresistive layer, which is electrodeposited onto an electrically conductive permalloy layer of a substrate before this is completely structured and has been provided with a protective aluminum oxide layer. A gold film required for the attachment of a bonding wire is finally deposited either directly preceding the protection or following the application of the aluminum oxide on the copper layer.

Method for manufacturing terminal contacts for thin-film magnetic heads

Method for manufacturing terminal contacts for thin-film magnetic heads. A photolithographic process sequence is desirable when manufacturing coherent terminal contacts for thin-film magnetic heads that allows the technological complexity to be kept as low as possible taking metrological and mechanical points of view into consideration. To that end, an electrically conductive permalloy layer, buried under a protective aluminum oxide layer, is structured with a metallic mask such that interconnects that temporarily short the magnetic heads having two write/read heads on a substrate element during the photolithographic process execution are brought together at a location which is later parted along a parting line. As a result of the short, the application of an additional, metallic carrier layer as a galvanic underlayment for a gold film is avoided.

In the fabrication of micro-electronic circuits, it is often necessary to arrange a number of patterned surfaces be well insulated from each other. At the same time, however, the pattern edges of the layer to be overlaid must present a defined slope angle of between the range of forty to sixty degrees, for example. The invention solves this problem through a two stage coating process in which a polymer is first applied which coats the edges and is then coated with a photoresist having good leveling properties.

Electrical isolation and leveling of patterned surfaces

A method for a definitive fixing of the breadth of magnetic layers in the vicinity of the end face of a recording carrier, which breadth determines the track breadth, in which an integrated magnetic head structure is carried on a substrate and has a large number of thin magnetic, non-magnetic, insulating and electrically conductive layers stacked one upon an another, and in which originally broader magnetic layers are partially worn down by ion bombardment, the zones not to be worn down being first covered with a mask. Ion bombardment is carried out at right angles to the thin layers, i.e. at right angles to the plane of the substrate, with the mask suitably disposed.

Method for the production of integrated magnetic head structures

An improved integrated magnetic head structure of the type having a plurality of thin metal layers forming a magnetic head winding. These layers are generally symmetrical to a plane of symmetry lying perpendicularly to a gap plane on a non magnetic, insulating substrate, and these layers have flanks which are, with increasing distance from the substrate, shortened by a predetermined length distance. This head structure requires only a few masks to make with a minimum of mask adjustments. Extremely fine structures can be produced.

Growing community of inventors

Maisach, Germany

Alfred Pichler