Patent Treuhand Gesellschaft Fur Elektrische Gluhlampen Mbh

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Osram Opto Semiconductors Gmbh

Osram Gmbh

Alfred Langer

Günter Waitl

Andreas Genz

Bernd Lewandowski

Manfred Deisenhofer

Guenter Waitl

Walter Kiele

Ekkehard Messner

Jurgen Reichardt

J Urgen Reichardt

Reinhard Weitzel

Walter Keile

A process for encapsulating a component made of organic semiconductors is provided which includes steps of: a) providing a housing including a substrate with electrical connections and a cover; b) mixing a soldering glass with at least one of a binder and a solvent; c) applying the soldering glass at least to the cover, in the form of an encircling bank; d) expelling the binder or solvent; e) sintering-on of the solder; f) covering the substrate with layers which represent the semiconductor component together with electrodes; g) placing the cover onto the substrate; and h) locally heating the soldering glass by means of a light source with a predetermined peak wavelength, wherein the housing parts and soldering glass are matched to one another such that their coefficients of thermal expansion differ from one another by less than 1.0&#xd7;10K.

Process for encapsulating a component made of organic semiconductors

An opto-electronic semiconductor element has a radiation emitting or receiving, that is, radiation active semiconductor chip secured to an electrically conductive base frame. One, or a plurality of chips, are surrounded by a housing which may be integral with or have, separately, a cover. All materials of the housing, as well as of the conductive base frame, have mutually matching thermal coefficients of expansion within the temperature ranges which arise during manufacture and in application of the semiconductive element, singly or as a plurality in a common housing. Glass, quartz glass, ceramic or glass ceramic are suitable for the housing or parts thereof; the conductive base frame is preferably made of cladded or jacketed copper wire or strip with an iron-nickel core. Assembling a plurality of chips in a housing which has a luminescence conversion layer, e.g. a phosphor applied thereto, permits construction of a flat light source.

Thermal expansion compensated opto-electronic semiconductor element, particularly ultraviolet (UV) light emitting diode, and method of its manufacture

Ultraviolet (UV) radiation in the UV-C and UV-B bands, which is particularly dangerous, is absorbed and filtered by quartz glass doped with between 0.065% and 3.25%, and preferably between 0.065% and 1.3% by weight, of cerium metal, or cerium as such. Preferably, the cerium is added to quartz sand and/or rock crystal, in form of a fine-grained powder of up to 2 0 .mu.m grain size, in form of cerium aluminate (CeAlO.sub.3), present in up to about 5% by weight, and preferably up to about 2%, and melted together in a single step. The quartz glass so obtained is particularly suitable for a metal halide discharge lamp, e.g. as an outer envelope (1), or as the discharge vessel (27) itself, or for halogen incandescent lamps, to form the quartz-glass light bulb or an envelope therefor. A small quantity of titanium oxide, up to about 0.05%, may be added as a further doping agent to the melt to further improve the UV absorption in the B and C bands.

Quartz glass with reduced ultraviolet radiation transmissivity, and

Ultraviolet (UV) radiation in the UV-C and UV-B bands, which is particularly dangerous, is absorbed and filtered by quartz glass doped with between 0.065% and 3.25%, and preferably between 0.065% and 1.3%, by weight, of cerium metal, or cerium as such. Preferably, the cerium is added to quartz sand and/or rock crystal, in form of a fine-grained powder of up to 20 .mu.m grain size, in form of cerium aluminate (CeAlO.sub.3), present in up to about 5% by weight, and preferably up to about 2%, by weight, and melted together in a single step. The quartz glass so obtained is particularly suitable for a metal halide discharge lamp, e.g. as an outer envelope (1), or as the discharge vessel (27) itself, or for halogen incandescent lamps, to form the quartz-glass light bulb or an envelope therefor. A small quantity of titanium oxide, up to about 0.05%, may be added as a further doping agent to the melt to further improve the UV absorption in the B and C bands.

Method of making a quartz glass tube having a reduced ultraviolet

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Kissing, Germany

Alfred Langer