Thermal Corporation

Modine Manufacturing Company

Alfred L Phillips

Jonathan P Wattelet

Michael J Wilson

Kevin L Wert

Dmitry K Khrustalev

John Broadbent

C James Rogers

Stephen B Memory

Zhijun Zuo

Anthony C DeVuono

Fredrick E Ganaway

A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.

Flexible loop thermosyphon

A modular cooling system ( ) is provided for use in an electronics enclosure ( ) mounting a plurality of heat generating electronic components ( ). The cooling system ( ) includes a cooling liquid supply manifold ( ), a cooling liquid return manifold ( ), and a plurality of cooling modules ( ) that are selectively mountable into the electronic enclosure ( ). The cooling system ( ) also includes a wall ( ) fixed in the enclosure to separate the electronic components ( ) from the manifolds ( ) to shield the electronic components ( ) from any of the cooling liquid ( ) should it leak from the system ( ).

Modular cooling system and thermal bus for high power electronics cabinets

A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. A second thermal energy transfer assembly includes a second thermal interface surface which is arranged in confronting relation to the first thermal interface surface. A clamping mechanism is arranged to move the second thermal interface surface between (i) a first position that is spaced away from the first thermal interface surface, and (ii) a second position wherein the second thermal interface surface is pressed against the first thermal interface surface so as to allow the busing of thermal energy from the first thermal energy transfer assembly to the second thermal energy transfer assembly by heat transfer from the first thermal interface surface to the second thermal interface surface.

Thermal bus for electronics systems

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Pine Grove, PA, United States of America

Alfred L Phillips