Infineon Technologies Ag

Qimonda Ag

Alfred Gottlieb

Horst Theuss

Jochen Dangelmaier

Albert Auburger

Martin Petz

Uwe Schindler

Andreas W&ouml;rz

Bernd R&ouml;mer

Bernd Römer

Martin Schr&ouml;der

Andreas Wörz

A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.

Integrated magnetic sensor component

The invention relates to a pressure sensor with an MEM structure (micro electro mechanical structure), which has a hollow housing in which a semiconductor chip with a pressure-sensitive area is arranged. In its interior and with parts of the semiconductor chip, the housing is covered by a first plastic compound, which has a lower level of deformation than a second plastic compound, which partly covers the pressure-sensitive area of the semiconductor chip.

Pressure sensor and process for producing the pressure sensor

A configuration of at least two TSOP memory chip housings stacked one on another, is described. Each of the TSOP memory chip housings has at least one memory chip with a number of pins disposed in an interior of the TSOP memory chip housing. The pins leading out of a respective TSOP memory chip housing and, via a rewiring configuration, are connected to pins leading out of a respectively directly adjacent TSOP memory chip housing of the same TSOP memory chip housing stack. In order to be able to produce such a housing stack as cost-effectively and simply as possible by an automated mounting method, the rewiring configuration is implemented in the form of leadframes respectively disposed between or at the side between the individual TSOP memory chip housings.

TSOP memory chip housing configuration

Growing community of inventors

Nittendorf/Undorf, Germany

Alfred Gottlieb