Texas Instruments Corporation

Georgia Tech Research Corporation

Alfred Gomes

George Reitsma

Abhijit Chatterjee

Evgeny Fomin

Pramodchandran Variyam

Sasikumar Cherubal

Scott Douglas Kulchycki

Domenico Granozio

Matthew Christopher Kessler

Ram Voorakaranam

A capacitive sensing system based on projected self-capacitance is suitable for use in printing systems/products to sense paper tray status. In example embodiments, a capacitive sensing system is adapted for sensing the condition/characteristics of paper in the paper tray, such as paper size, stack height and page count and paper dielectric. The capacitive sensing system can be configured with one or more shielded capacitive sensors incorporated into the paper tray, and oriented relative to the paper according to the paper condition/characteristic sensed.

Capacitive sensing for paper tray

One example includes a position sensing system. The system includes an inductive position element that is moveable and comprises a position inductor. The system also includes a plurality of inductive load elements. Each of the inductive load elements includes a load inductor. Each of the plurality of inductive load elements can be selectively controlled in response to a modulation signal to provide a corresponding mutual inductance between the position inductor and the respective load inductor, the corresponding mutual inductance depending on a position of the inductive position element relative to the respective load inductor. The system further includes a position controller configured to generate the position and modulation signals and to calculate the position of the inductive position element relative to the plurality of inductive load elements based on a difference of the position signal with respect to the mutual inductance between the position inductor and each respective load inductor.

Inductive position-sensing

A low cost signature test for RF and analog circuits. A model is provided to predict one or more performance parameters characterizing a first electronic circuit produced by a manufacturing process subject to process variation from the output of one or more second electronic circuits produced by the same process in response to a selected test stimulus, and iteratively varying the test stimulus to minimize the error between the predicted performance parameters and corresponding measured values for the performance parameters, for determining an optimized test stimulus. A non-linear model is preferably constructed for relating signature test results employing the optimized test stimulus in manufacturing testing to circuit performance parameters.

Method and apparatus for low cost signature testing for analog and RF circuits

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Sunnyvale, CA, United States of America

Alfred Gomes