Heraeus Nexensos Gmbh

Alfred Fleckenstein

Stefan Dietmann

Dieter Teusch

Thomas Loose

An AlOcarrier has a thin-film structure of platinum or a platinum alloy arranged thereon. The carrier and/or the thin-film structure are adapted to reduce mechanical stresses owing to different thermal expansion coefficients. The carrier and/or the thin-film structure include a surface of the carrier in the region of the thin-film structure is smoothed at least in sections to reduce the adhesion and/or a surface of the carrier has an intermediate layer on which the thin-film structure is arranged. The thermal expansion coefficient of the intermediate layer is from 8*10/K to 16*10/K, in particular from 8.5*10/K to 14*10/K, and/or the thin-film structure has at least one conductor path that is undular at least in sections, said conductor path extends laterally along the surface of the carrier.

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Heinrichsthal, Germany

Alfred Fleckenstein