Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Alfred Bergler

Hanns Wochner

Theresia Bauer

Susanne Weizbauer

A process is taught for etching semiconductor wafers with an etching mixture comprising nitric and hydrofluoric acids and optionally a surfactant. To this mixture are added either more hydrofluoric acid, or more hydrofluoric and nitric acids, with the added acids having concentrations of at least 70% by weight. The use of concentrated acids reduces the loss of substrate material and extends etching bath life.

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Neuotting, Germany

Alfred Bergler