Lockheed Martin Corporation

Kuprion Inc.

Nanyang Technological University

Ultramet Incorporated

Alfred A Zinn

Peter V Bedworth

Timothy Brian Stachowiak

Randall Mark Stoltenberg

Chee Lip Gan

Justin Samuel Golightly

Yeng Ming Lam

Byung Hoon Lee

Loosineh Avakians

Andrew Thomas Fried

Mei Zhen Ng

Paul P Lu

Zhenggang Li

Randall M Stoltenberg

Jaewon Kim

Arthur C Paolella

Susan P Ermer

Jyotsna Iyer

Michael J Mayo

Ike C Hsu

Khanh Nguyen

Jerome Chang

Adam Theron Winter

David S Degler

Tim Stachowiak

Roux M Heyns

Charles Packer

Frances Chiu

Earl Montgomery

David Scott

Sidney Hu

Robert Barrett Geyer

Lawrence C Loh

Kelly M Parent

Susan Patricia Ermer

David Guy Hanni

James Charles Beffa

Copper nanoparticle paste compositions may be formulated for forming connections that are capable of operating at high temperatures by including a grain growth inhibitor with copper nanoparticles in a suitable amount. Such nanoparticle paste compositions may comprise copper nanoparticles and 0.01-15 wt. % of a grain growth inhibitor or a precursor to a grain growth inhibitor admixed with the copper nanoparticles, in which the grain growth inhibitor comprises a metal. The grain growth inhibitor is insoluble in a bulk copper matrix and is capable of residing at one or more grain boundaries in the bulk copper matrix. The one or more grain boundaries may be formed after the copper nanoparticles undergo consolidation to form bulk copper. The grain growth inhibitor may comprise various metals that are insoluble in bulk copper.

Nanoparticle paste compositions and connections formed therefrom

Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper.

Thermal management in circuit board assemblies

Metal nanoparticle agglomerates may convey biocidal activity to surfaces upon which they are deposited and become adhered, such as various air filtration media. Air filtration media may comprise a plurality of fibers having a plurality of metal nanoparticle agglomerates adhered thereto. The metal nanoparticle agglomerates may comprise a plurality of fused, partially fused, or unfused metal nanoparticles that are associated with one another upon a surface of the plurality of the fibers. Suitable metal nanoparticles for promoting biocidal activity against various pathogens, such as viruses and bacteria, may include copper nanoparticles and/or silver nanoparticles. Masks, inline filters, and air filtration systems may incorporate the air filtration media.

Air filtration media having metal nanoparticle agglomerates adhered thereto, formation thereof and use thereof

Electronic assemblies may be fabricated with interconnects of different types present in multiple locations and comprising fused copper nanoparticles. Each interconnect or a portion thereof comprises a bulk copper matrix formed from fusion of copper nanoparticles or a reaction product formed from copper nanoparticles. The interconnects may comprise a copper-based wire bonding assembly, a copper-based flip chip connection, a copper-based hermetic seal assembly, a copper-based connector between an IC substrate and a package substrate, a copper-based component interconnect, a copper-based interconnect comprising via copper for establishing electrical communication between opposite faces of a package substrate, a copper-based interconnect defining a heat channel formed from via copper, and any combination thereof.

Electronics assemblies employing copper in multiple locations

According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

Ink composition, method for forming a conductive member, and conductive device

Printed circuit boards may be formed using ceramic substrates with high thermal conductivity to facilitate heat dissipation. Metal nanoparticles, such as copper nanoparticles, may be used to form conductive traces and fill through-plane vias upon the ceramic substrates. Multi-layer printed circuit boards may comprise two or more ceramic substrates adhered together, wherein each ceramic substrate has one or more conductive traces defined thereon and the one or more conductive traces are formed through consolidation of metal nanoparticles. The one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto.

Ceramic-based circuit board assemblies formed using metal nanoparticles

Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.

According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.

Method of interconnecting nanowires, nanowire network and transparent conductive electrode

Metal nanoparticles and compositions derived therefrom can be used in a number of different applications. Methods for making metal nanoparticles can include providing a first metal salt in a solvent; converting the first metal salt into an insoluble compound that constitutes a plurality of nanoparticle seeds; and after forming the plurality of nanoparticle seeds, reacting a reducing agent with at least a portion of a second metal salt in the presence of at least one surfactant and the plurality of nanoparticle seeds to form a plurality of metal nanoparticles. Each metal nanoparticle can include a metal shell formed around a nucleus derived from a nanoparticle seed, and the metal shell can include a metal from the second metal salt. The methods can be readily scaled to produce bulk quantities of metal nanoparticles.

Metal nanoparticles formed around a nucleus and scalable processes for producing same

A cable can be used to facilitate electrical connections between electrical components. The cable can include a plurality of cable strands forming a void space. An adhesive paste can be applied within the void space. The adhesive paste can include a plurality of metallic nanoparticles. The metallic nanoparticles can fuse with each other and with the plurality of cable strands when energy is applied the connector and the cable. The metallic nanoparticles can include a surfactant, which can be displaced as pressure is applied. Heat can be applied to the adhesive paste to fuse the metallic nanoparticles.

Cable with nanoparticle paste

A circuit assembly can be made by adhering a conductive element to a substrate with an adhesive. A first layer including an adhesive can be applied over at least a portion of a surface of the substrate. A second layer including a conductive metal can be applied over at least a portion of the first layer. The first layer and the second layer can be exposed to a temperature for a duration of time to (1) fuse the conductive metal together in at least a portion of the first layer and (2) cure the adhesive of the second layer. The fusing can be substantially complete before the curing is substantially complete to enhance bonding of the adhesive to the fused conductive metal.

Nanoparticle application with adhesives for printable electronics

An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed.

Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas

Growing community of inventors

Palo Alto, CA, United States of America

Alfred A Zinn