Fujifilm Electronic Materials U.s.a., Inc.

Fujifilm Planar Solutions, LLC

Alexei P Leonov

Abhudaya Mishra

The disclosure provides chemical mechanical polishing compositions and methods for polishing polysilicon films with high removal rates. The compositions include 1) an abrasive; 2) at least one compound of structure (I): 3) at least one compound of structure (II): and 4) water; in which the composition does not include tetramethylammonium hydroxide or a salt thereof. The variables n, R-R, X, Y, and Z-Zin structures (I) and (II) are defined in the Specification. The synergistic effect of the compounds of structures (I) and (II) in these chemical mechanical polishing compositions leads to high polysilicon films material removal rate during polishing.

Growing community of inventors

Gilbert, AZ, United States of America

Alexei P Leonov