3d Plus

Packaging Sip

Alexandre Val

Christian Val

Fabrice Soufflet

Pascal Couderc

An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical connection balls for the external electrical connection of the electronic module. The PCB circuit comprises a hermetically protective electrically insulating inorganic inner layer, and the module comprises six faces with an electrically insulating or conductive inorganic hermetic protection layer on the five faces other than that formed by the PCB circuit.

Process for the wafer-scale fabrication of hermetic electronic modules

A process for manufacturing at least one 3D electronic module each comprises a stack of electronic packages and/or printed wiring boards, wherein a stack is placed on an electrically interconnecting system comprising metal leads each having two ends. The process comprises the following steps: starting with a lead frame that comprises metal leads, folding by about 180&#xb0; the leads in order to obtain what is referred to as an internal frame portion including the folded ends, which are intended to be molded, the other portion, which is what is referred to as an external portion, including the unfolded exterior ends, the two ends of each lead being intended to emerge from the 3D module on a given face cut along Z; depositing on the leads a metal coating; placing the external portion of the frame between two, an upper and lower, protective elements while leaving the internal portion free, and placing the frame and the protective elements on a carrier; placing each stack equipped each with exterior interconnection tabs so as to superpose the exterior tabs on the internal portion; molding, in a resin, the stack, the exterior tabs and the internal portion and thereby partially covering the upper protective element; cutting the resin and thereby leaving flush conductive sections of the exterior tabs and of the ends of the leads and removing the resin from the upper protective element; metallizing the cut faces; removing the carrier; and removing the protective elements in order to expose the leads of the external portion.

Process for manufacturing a 3D electronic module comprising external interconnection leads

A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink.

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Le Chesnay, France

Alexandre Val