Stmicroelectronics S.a.

Alexandre Castellane

Luc Petit

R&eacute;mi Brechignac

Process for producing electrical-connections on a semiconductor package containing an integrated-circuit chip and with an external protective layer having apertures that least partly expose metal electrical-connection regions, and semiconductor package provided with such metal electrical-connections. The apertures having walls are filled with a metal electrical-connection layer covering at least their walls. A metal solder drop is soldered to the connection layer so that it is not in contact with the external protective layer.

Process for producing electrical-connections on a semiconductor package, and semiconductor package

A semiconductor package having an encapsulation that encapsulates an integrated circuit chip and an external lead frame for the chip. Multiple connection leads project from the periphery of the encapsulation. At least one external face of the encapsulation is covered with a layer of electrically conductive material, and the conducting material layer has at least one lateral extension that electrically contacts at least one of the projecting connection leads. A method of manufacturing such a semiconductor package is also provided.

Growing community of inventors

Colombe, France

Alexandre Castellane