International Business Machines Corporation

Alexandre Blander

Julien Sylvestre

Michael A Gaynes

Timothy Harrison Daubenspeck

Charles Leon Arvin

Gareth Geoffrey Hougham

Jon Alfred Casey

Eric D Perfecto

Krystyna Waleria Semkow

Brian Richard Sundlof

Kamalesh K Srivastava

Peter Jeffrey Brofman

Ian D Melville

Donald W Henderson

Hsichang Liu

Marie-Claude Paquet

Jennifer V Muncy

Renee L Weisman

Eric Salvas

Martin Beaumier

Pascale Gagnon

Eric Giguere

Luc Tousignant

Srinivasa S N Reddy

Richard Brassard

Carl Savard

Srinivasa Sn Reddy

An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

Grounded lid for micro-electronic assemblies

In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.

Additives for grain fragmentation in Pb-free Sn-based solder

A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.

Passivation layer surface topography modifications for improved integrity in packaged assemblies

A method of using acoustic signals in the form of waves or pulses to non-destructively measure the thickness of a bonding layer sandwiched between and bonding together overlying and underlying materials different from the bonding layer especially when the thickness of the bonding layer is so small that the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the overlying material is indistinguishable, i.e., not independently observable from the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the underlying material.

Method for measuring thin layers in solid state devices

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Montreal, Canada

Alexandre Blander