International Business Machines Corporation

Alexandra Welzel

Rolf Schaefer

Marcus Breuer

Michael Haag

Guenther Crolly

Manfred Jung

Thorsten Muehge

Johannes Paul

Joerg Sauerwein

A method of manufacturing a magnetic field sensor device in one embodiment includes applying a mask on a substrate, performing a wet etching procedure on the substrate for generating at least a first groove having tilted side walls, and depositing at least one layer of magnetoresistive material onto a section of the surface of at least a first tilted side wall of the groove. A method of manufacturing a magnetic field sensor device on a substrate having a plurality of tilted planar sections, each of the tilted planar sections having a surface normal angled with respect to a surface normal of the substrate is also provided. The method includes depositing a magnetoresistive layered structure positioned at each of the tilted planar sections of the substrate, wherein the tilted planar sections are oriented such that a direction of an applied magnetic field in at least one of an x-, y- and z-direction relative to the substrate is detectable based on field-induced resistance changes of the magnetoresistive layered structures.

Method of manufacturing a magnetic sensor with tilted magnetoresistive structures

A magnetic field sensor device comprising a substrate having at least a first tilted planar section having a surface normal at a first angle with respect to a surface normal of the substrate, and at least a first magnetoresistive layered structure positioned at the at least first tilted section. Methods for manufacturing magnetic field sensor devices are also presented.

Magnetic sensor with tilted magnetoresistive structures

Embodiments of the present invention provide a thin-film coil assembly. The coil assembly includes a substrate, at least two layers of conductive material on top of the substrate, and one layer of insulating material between the two layers of conductive material, wherein the two layers of conductive material are in contact with two interconnects, respectively, which extends substantially vertical to the substrate.

Multilayer coil assembly and method of production

Growing community of inventors

Hahnheim, Germany

Alexandra Welzel