Osram Opto Semiconductors Gmbh

Osram Gesellschaft MIT Beschrankter Haftung

Osram Oled Gmbh

Osram Opto Semiconductor Gmbh

Osram Gmbh

Alexander Wilm

Mario Wanninger

Markus Hofmann

Siegfried Herrmann

Stefan Grötsch

Günter Waitl

Moritz Engl

Michael Sailer

Stefan Groetsch

Julius Muschaweck

Ion Stoll

Ewald Karl Michael Guenther

Thomas Reiners

Roland Schulz

Rainer Huber

Harald Stoyan

Ralf Vollmer

Michael Brandl

Alexander Baumgartner

Elmar Baur

Horst Varga

Ewald Karl Michael Günther

Felix Michel

Florin Oswald

Monika Rose

Stefan GRÖTSCH

Ewald Karl Michael GÜNTHER

A radiation-emitting optoelectronic component may include a semiconductor chip or a semiconductor laser which, in operation of the component, emits a primary radiation in the UV region or in the blue region of the electromagnetic spectrum. The optoelectronic component may further include a conversion element comprising a first phosphor configured to convert the primary radiation at least partly to a first secondary radiation having a peak wavelength in the green region of the electromagnetic spectrum between 475 nm and 500 nm inclusive. The first phosphor may be or include BaSiAlN, SrSiAlON, BaSiNO, ALiXO, M*Z*[A*B*C*D*E*NO], and combinations thereof.

Radiation-emitting optoelectronic component

A lighting device and a lighting system are disclosed. In an embodiment, a lighting device includes at least one optoelectronic semiconductor chip, two contacts configured to couple the lighting device to a DC voltage and a driver circuit interconnected in series with the at least one semiconductor chip in a string, wherein the driver circuit comprises a monolithic, unhoused controller, wherein the driver circuit is configured to adjust a current for operating the at least one semiconductor chip, and wherein the string extends between the two contacts in an electrically coupling way.

Illumination device and illumination system

A method of arranging a multiplicity of LEDs in packaging units includes defining a desired range for at least one photometric measurement variable for each of the packaging units; selecting an LED from the multiplicity of LEDs not yet arranged in one of the packaging units; measuring the at least one photometric measurement variable for the selected LED; equipping one of the packaging units containing fewer than N&#x2212;1 LEDs with the selected LED; storing a measured value and a position of the selected LED in the packaging unit in a memory; repeating until the packaging units are equipped with N&#x2212;1 LEDs; repeating and calculating the average value of the photometric measurement variable, equipping a packaging unit for which the calculated average value of the variable lies in a defined range with the selected LED; and storing the measured value and the position of the selected LED.

Method of arranging a multiplicity of LEDs in packaging units, and packaging unit including a multiplicity of LEDs

The invention relates to a light-emitting semiconductor component, having: a light-emitting semiconductor chip () with an active region () which, in operation, emits light () having a first spectrum; a wavelength conversion element () which is positioned remote from the semiconductor chip (), is downstream of the semiconductor chip () in the beam path of the light () having the first spectrum and converts the light () having the first spectrum at least partially into light () having a second spectrum; and a filter layer (), which reflects at least a part () of a light () incident on the semiconductor component from the outside. The part () of the light () incident on the semiconductor component from the outside that is reflected by the filter layer () has a visible wavelength range and overlaps a color impression produced by the wavelength conversion element when the semiconductor component is in a switched-off state.

Light-emitting semiconductor component

A method of combining LEDs in a packaging unit includes determining a color locus of a multiplicity of LEDs, classifying the LEDs into a plurality of different color locus ranges, each LED classified into a color locus range comprising the determined color locus of the respective LED, arranging the LEDs in the packaging unit such that the packaging unit contains a plurality of successive sequences respectively of a plurality of LEDs, wherein each sequence respectively has exactly one LED from each of the color locus ranges, and the LEDs of the different color locus ranges are respectively arranged in the same order within the sequences.

Method for combining LEDS in a packaging unit and packaging unit having a multiplicity of LEDS

An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.

LED projector

An optical lighting device includes a radiation detector, a first light source and a second light source. The radiation detector includes a semiconductor chip and an optical filter, and has a spectral sensitivity distribution. The first light source generates white radiation. The second light source generates monochrome radiation in the visible spectral range, wherein radiation emitted by the first light source and radiation emitted by the second light source are superimposed to yield mixed radiation which includes a wavelength spectrum. The wavelength spectrum of the mixed radiation is adapted to the spectral sensitivity distribution of the radiation detector.

Optical lighting device and optical recording device

A multicolour LED, in which layers for generating light of different colors are arranged one above the other, is used as the light source in a projector.

Projector for micro projection surfaces and use of a multicolour LED in a projector

An optoelectronic component with a desired color impression in the switched-off state includes, in particular, a semiconductor layer sequence with an active region, that during operation radiates electromagnetic radiation with a first spectrum, and a wavelength conversion layer that is disposed downstream from the semiconductor layer sequence in the beam path of the electromagnetic radiation with the first spectrum, and that at least partially converts a subspectrum of the electromagnetic radiation with the first spectrum into electromagnetic radiation with a second spectrum, and a filter layer that reflects at least a part of the radiation incident from outside onto the optoelectronic component.

Optoelectronic component

An array of light-emitting diodes in LED chips, which can be turned on and off individually or in groups by means of a circuit, is provided with a device for homogenizing a light beam emitted by the turned-on LED chips. This device can be a conversion plate, a potting compound comprising a converter material or scattering particles, or a device for beam shaping comprising a plurality of micro-optics. The light source is particularly suited for headlights, for example in AFS applications.

Light source with variable radiation characteristic

A lighting device is disclosed comprising a plurality of semiconductor light sources disposed on a carrier, wherein the light from the light sources is coupled into assigned lightguides at a set angle to the surface normals of the carrier and the lightguides are provided with reflecting and light exit faces such that the envelope of the light outcoupling faces forms a curved surface segment.

Lighting device comprising a plurality of semiconductor light sources

An illumination device comprising a connection carrier (), at least one light-emitting diode (), an electrically insulating layer () and a fixing device () is specified. The connection carrier () has a first main area () and a second main area () remote from the first main area. The light-emitting diode () is fixed on the first main area () of the connection carrier (). The electrically insulating layer () is fitted to the second main area () of the connection carrier () and projects laterally beyond the second main area () of the connection carrier (). The fixing device () is suitable for fixing the illumination device to a mounting area () of a carrier (), wherein the electrically insulating layer () is arranged between the second main area () of the connection carrier () and the mounting area () of the carrier (). Furthermore, the fixing device () presses the connection carrier () against the mounting area (). The pressure exerted in this way is used to effect a fixing of the insulating layer () between the second main area () of the connection carrier () and the mounting area (). The fixing device () is connected to an optical element (), which optically influences the light generated by the light-emitting diode () during operation.

Illuminating device

A motor vehicle headlight () comprises at least two modules () for light production, the radiation characteristics of at least one of the modules () being adjustable in a reference system associated with the headlight. Preferably, modules () of the headlight () have different radiation characteristics and the irradiation characteristics of at least two of the modules () overlap to form an adjustable radiation characteristic of the headlight ().

Motor vehicle headlight

A light-emitting module is specified that comprises a light source, a carrier for said light source, and an optical element, wherein the optical element comprises dowel pins that engage in corresponding recesses in the carrier. The light-emitting module is particularly well suited for use in optical projection apparatuses and in motor vehicle projection lamps.

Light-emitting module

A lighting device with a light source followed by an optical apparatus in an emission direction, and a primary optics element with a light inlet and a light outlet being arranged between the light source and the optical apparatus. The primary optics element is designed such that desired characteristics of the light beam are formed within the primary optics element by deliberate reflections on specially shaped reflective surfaces of the primary optics element.

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Wuppertal, Germany

Alexander Wilm