Nordson Corporation

Alexander Wilhelm

Eric Lingier

Laurence B Saidman

Wesley C Fort

Mark Aaron Gould

Leonard J Lanier

Victor De Leeuw

Steven Clark

Inspection devices and methods for inspecting an adhesive pattern on a substrate are disclosed. The inspection device includes at least one sensor having a heat sensor head for detecting a pattern of the adhesive bead, and a controller. Reference data representing a desired adhesive pattern is initially provided to a controller. A predetermined tolerance range for the desired adhesive pattern is also provided to the controller. An adhesive bead is discharged onto a substrate from a nozzle. A pattern of the discharged adhesive bead is then detected by the sensor when the substrate moves. Signals representing the detected pattern are received from the sensor at the controller. Finally, the signals representing the detected adhesive pattern are compared to the tolerance range of the desired adhesive pattern.

Inspection device and method for inspecting an adhesive pattern on a substrate

A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section in the form of an elongated ring shape, having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange device further includes a heating element for heating the liquid adhesive material flowing through the thin slit section.

Heat exchange device with ring shaped thin slit section for use in liquid adhesive systems and related methods

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Duesseldorf, Germany

Alexander Wilhelm