Dow Global Technolgoies LLC

Alexander Stolarz

Mridula Babli Kapur

Stephanie M Whited

Siddharth Ram Athreya

Adriana Velasquez

The present disclosure provides formulation. The formulation contains a high density polyethylene composition containing (i) a high molecular weight component including an ethylene/a-olefin copolymer, the high molecular weight component having a density from 0.924 to 0.930 g/cc and a high load melt index (121) from 0.3 to 0.9 g/10 min; and (ii) a low molecular weight component including an ethylene-based polymer selected from the group consisting of an ethylene homopolymer and an ethylene/a-olefin copolymer. The high density polyethylene composition has (a) a density from 0.950 to 0.956 g/cc; (b) a high load melt index (121) from 15 to 28 g/10 min; (c) an 121/12 of at least 85; (d) a notched constant tensile load failure time at 35% yield stress of greater than 90 hours; and (e) an environmental stress crack resistance (ESCR) F0 value, according to ASTM D1693&#x2014;condition B (100% IGEPAL), of greater than 2,000 hours.

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Horgen, Switzerland

Alexander Stolarz