Kateeva, Inc.

Applied Materials, Inc.

Other

Alexander Sou-Kang Ko

Eliyahu Vronsky

Justin Mauck

Shandon Alderson

Conor Francis Madigan

Gregory Lewis

Christopher Buchner

Robert B Lowrance

Nahid Harjee

Digby Pun

Karl Mathia

Christopher R Hauf

Eugene Rabinovich

Stephen Mark Smith

Aleksey Khrustalev

Lucas David Barkley

Valerie Gassend

Eashwer Chandra Vidhya Sagar Kollata

Prahallad Iyengar

Alexey Stepanov

Eli Vronsky

Robert Dennis Taff

Matthew Burton Sheffield

Cormac McKinley Wicklow

David C Donovan

Senn Van Ly

Geoffrey Kenneth Love

David Craig Darrow

Bernardo Donoso

Duane DeMore

Manoocher Birang

Donald J Olgado

Kapila P Wijekoon

Joseph Stevens

Jianglong Chen

Christopher E Todd

James Kundrat

Eliyahu Vronksky

A drying chamber for drying a substrate patterned with display areas wetted by OLED materials dissolved or suspended in a volatile carrier liquid and separated from one another by dry boundary regions. A mask adjusts drying rate of the carrier liquid during vacuum extraction using vapor-transmissive areas opposite the wet areas and vapor-barrier regions opposite the dry boundary regions, or by confining the wet areas collectively in a chamber volume small enough to quickly saturate with the carrier liquid before vacuum extraction.

Systems and methods for drying patterned OLED formulations

In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.

Ejection control using substrate alignment features and print region alignment features

The present teachings relate to various embodiments of a hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of a hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.

Gas enclosure assembly and system

The present teachings disclose various embodiments of a printing system for printing substrate, in which the printing system can be housed in a gas enclosure, where the environment within the enclosure can be maintained as a controlled printing environment. A controlled environment of the present teachings can include control of the type of gas environment within the gas enclosure, the size and level particulate matter within the enclosure, control of the temperature within the enclosure and control of lighting. Various embodiments of a printing system of the present teachings can include a Y-axis motion system and a Z-axis moving plate that are configured to substantially decrease excess thermal load within the enclosure by, for example, eliminating or substantially minimizing the use of conventional electric motors.

Printing system assemblies and methods

A drop placement analyzer for an inkjet printer is described herein. The drop placement analyzer comprises a film support that has an opaque, optically non-interfering vacuum surface for immobilizing a film against the optically non-interfering vacuum surface and photographing drops disposed on the film from the same side of the film on which the drops are disposed.

Drop placement analyzer for inkjet printing system

An inkjet printer has a print assembly and a print material feed system comprising a first circulation circuit and a second circulation circuit, the first circulation circuit fluidly coupled between the second circulation circuit and the print assembly.

Print material feed system

A substrate for an inkjet printer is described herein. The substrate comprises a material selected to provide high contrast reflected light and having a print material receiving surface with a neutral response to the print material.

Test substrate for inkjet printer drop placement analyzer

An inkjet printer is disclosed that has a substrate support; a calibration module disposed adjacent to the substrate support and comprising a stage member; and a print assembly disposed across the substrate support, the print assembly comprising a printhead and a calibration imaging device positionable to face the stage member.

Printer calibration module

A method comprises processing a substrate in a gas enclosure to form a film on one or more portions of the substrate. The method further comprises, while processing the substrate, circulating gas along a circulation path through the gas enclosure. Circulating the gas may comprise flowing gas through an exhaust housing enclosing a printhead assembly housed in the gas enclosure and filtering the gas flowing downstream of the printhead assembly from the exhaust housing.

Low-particle gas enclosure systems and methods

An inkjet printer is described. The inkjet printer has a substrate holder assembly that includes a base member having a long axis in a first direction and a short axis in a second direction perpendicular to the first direction; a contact member coupled to the base member, the contact member having a long axis in the first direction and a short axis in the second direction; a holder carriage coupled to the base member; a linear extender coupled between the base member and the contact member and extending in a third direction intersecting with the first direction and the second direction from the base member toward the contact member; and a flex member coupled to the base member, extending in the second direction between the linear extender and the contact member, and having a flex direction in a direction perpendicular to the first direction and the second direction.

Inkjet printer with substrate height position control

Apparatus and techniques are described herein for use in manufacturing electronic devices. such as can include organic light emitting diode (OLED) devices. Such apparatus and techniques can include using one or more modules having a controlled environment. For example, a substrate can be received from a printing system located in a first processing environment, and the substrate can be provided a second processing environment, such as to an enclosed thermal treatment module comprising a controlled second processing environment. The second processing environment can include a purified gas environment having a different composition than the first processing environment.

Techniques for thermal treatment of electronic devices

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an 'ideal' conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

Guided transport path correction

The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.

Growing community of inventors

Santa Clara, CA, United States of America

Alexander Sou-Kang Ko