Bridgelux Incorporated

Alexander Shaikevitch

Rene P Helbing

Vahid S Moshtagh

A system for flash-free over-molding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.

System for flash-free over-molding of LED array substrates

System for flash-free overmolding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.

System for flash-free overmolding of led array substrates

A reflective surface sub-assembly for a light-emitting device, comprising a substrate, at least one area reserved for placement of a light-emitting device assembly on the substrate, and a diffusive reflective layer applied on selected regions on the substrate, wherein if the light-emitting device assembly were placed onto the at least one area then the diffusive reflective layer would reflect photons emitted by the light-emitting device assembly is disclosed.

Reflective surface sub-assembly for a light-emitting device

A method for manufacturing a reflective surface sub-assembly for a light-emitting device, comprising a substrate, at least one area reserved for placement of a light-emitting device assembly on the substrate, and a diffusive reflective layer applied on selected regions on the substrate, wherein if the light-emitting device assembly were placed onto the at least one area then the diffusive reflective layer would reflect photons emitted by the light-emitting device assembly is disclosed.

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Livermore, CA, United States of America

Alexander Shaikevitch