Endress+hauser Conducta Gmbh+co. Kg

Alexander Serfling

Stephan Buschnakowski

Thomas Nagel

Torsten Pechstein

Christian Fanselow

Sven-Matthias Scheibe

Stefan Paul

Jörg Uhle

An assembly with a secondary coil arranged on a coil carrier for a field device is described, wherein the field device comprises an electronics and an inductive interface connected to the electronics, and wherein the assembly can be used in the field device such that the field device can be connected via its interface to an inductive interface of a superordinate unit such that the secondary coil of the assembly, with a primary coil of the inductive interface of the superordinate unit, form a transformer for transmitting data and/or energy, which makes it possible to reduce the dimensions of field devices equipped with it and also contributes to increased operational safety, in that an assembly circuit formed by the secondary coil and at least one electronic component connected to the secondary coil via lines connected to it and arranged on the coil carrier is arranged on the coil carrier.

Assembly with one secondary coil for a field device with one inductive interface

The present disclosure discloses a conductivity sensor including a basic body of sintered ceramic having at least two cavities disposed on a frontal face and a metal electrodes disposed in each cavity. Each electrode is about one fifth the length of the basic body. Electrical cables extend from a rear face of the basic body into holes in each cavity and contact the electrodes. A solder paste or an electrically conductive adhesive disposed in each hole connects each cable with the respective metal electrode electrically and mechanically.

Method for contacting at least two metal electrodes and arrangement

A method for contacting at least two metal electrodes, wherein the metal electrodes are located in a cavity of a basic body of sintered ceramic and frontal end faces of the metal electrodes. The metal electrodes are arranged essentially planparallel to an outer surface of the basic body. The method includes steps as follows: introducing a solder into at least one hole of the basic body, wherein the hole is so embodied that it leads to a rear portion of the metal electrode away from the frontal end face of the metal electrode wherein the solder can wet the rear portion of the metal electrode, wherein the metal electrodes are in their longitudinal direction shorter than the basic body, especially have only &#x2155; of the length of the basic body; introducing a cable into the hole at least until the cable extends into the solder; and heating the basic body with solder and cable above the solidification temperature of the solder. The invention relates further to an arrangement and to a conductivity sensor comprising such an arrangement.

A sensor, especially a conductive conductivity sensor, to determine a measurand, especially the conductivity, of a medium, including: a process interface shaped as a hollow cylinder and made of a metal, with the process interface having at least two internal segments; a mainly cylinder-shaped sensor element that is mainly made of a ceramic, with a first section to introduce the sensor element into the process interface and a second section with which the sensor element protrudes from the process interface. The first section of the sensor element has at least two segments, wherein the respective first segment of the process interface and the sensor element are designed as a press fit, and the respective second segment of the process interface and the sensor element create a gap and a method to manufacture such a sensor.

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Leipzig, Germany

Alexander Serfling