Infineon Technologies Ag

Alexander Schwarz

Andreas Grassmann

Wolfram Hable

Ottmar Geitner

Frank Winter

Alexander Herbrandt

Inpil Yoo

Christoph Koch

Andre Uhlemann

Christian Neugirg

Markus Thoben

Lothar Koenig

An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.

Electronic module and method of manufacturing the same

In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.

Substrate, chip arrangement, and method for manufacturing the same

According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.

Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip

Growing community of inventors

Moehnesee, Germany

Alexander Schwarz