Air Products and Chemicals, Inc.

International Business Machines Corporation

Btu International, Inc.

Alexander Schwarz

Wayne Thomas McDermott

Chun Christine Dong

Richard E Patrick

Thomas Hsiao-Ling Hsiung

Richard Carl Ockovic

Gregory Khosrov Arslanian

Timothy Christopher Golden

Gary A Orbeck

Donald A Seccombe, Jr

James Hsu-Kuang Yang

Iosif Chernyakov

Fred William Taylor

Jin J Wu

Douglas L Bennett

Douglas W Cooper

Henry L Wolfe

Charles E Kalb

Rakesh Agrawal

Vladimir Yliy Gershtein

Robert M Thorogood

Andrew David Johnson

John Frederick Cirucci

John C Ivankovits

Keith Alan Ludwig

Hoshang Subawalla

Delbert D Christman

Dean V Roth

Jose Rui Machado

Charles C Goebel

Delbert Dean Christman

An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.

Electrode assembly for the removal of surface oxides by electron attachment

The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

Apparatus for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation

The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.

Removal of surface oxides by electron attachment for wafer bumping applications

Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation

Method for processing an article by contacting the article with a dense fluid. The article is introduced into a sealable processing chamber and the processing chamber is sealed. A dense fluid is prepared by introducing a subcritical fluid into a pressurization vessel and isolating the vessel, and then heating the subcritical fluid at essentially constant volume and essentially constant density to yield a dense fluid. At least a portion of the dense fluid is transferred from the pressurization vessel to the processing chamber, wherein the transfer of the dense fluid is driven by the difference between the pressure in the pressurization vessel and the pressure in the processing chamber, thereby pressurizing the processing chamber with transferred dense fluid. The article is contacted with the transferred dense fluid to yield a spent dense fluid and a treated article, and the spent dense fluid is separated from the treated article.

Dense phase processing fluids for microelectronic component manufacture

Method for processing an article with a dense processing fluid in a processing chamber while applying ultrasonic energy during processing. The dense fluid may be generated in a separate pressurization vessel and transferred to the processing chamber, or alternatively may be generated directly in the processing chamber. A processing agent may be added to the pressurization vessel, to the processing chamber, or to the dense fluid during transfer from the pressurization vessel to the processing chamber. The ultrasonic energy may be generated continuously at a constant frequency or at variable frequencies. Alternatively, the ultrasonic energy may be generated intermittently.

Processing of semiconductor components with dense processing fluids and ultrasonic energy

The invention relates to a process and apparatus for delivering an ultra high purity fluid comprising at least one component to a point of use at a required pressure without mechanical pumping. In one embodiment, a high purity feed comprising at least one component in gaseous or liquid form is charged into a vessel and at least partially converted to a solid phase source. As the feed is converted to a solid phase source, additional feed may be added until the vessel is at least substantially filled with a solid phase source or slush. Once filled, the solid phase source or slush may be isochorically heated whereby the solid phase source is converted to a product at an elevated pressure.

Generation and delivery system for high pressure ultra high purity product

Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation

Carbon monoxide (CO) is removed from a nitrogen and CO containing gas stream such as feed air to an air separation process for recovery of a nitrogen product gas stream or a nitrogen product gas stream from an air separation process by adsorbing CO from said gas stream before or after separation of oxygen from said gas stream to produce a product gas stream containing less than 5 ppb of CO by contacting said gas stream With a solid adsorbent such as a Mn, Fe, Ni, Cu, Ag, Pd, Co, Pt or Au exchanged zeolite and periodically regenerating the adsorbent by desorption of CO therefrom under a flow of regenerating gas, and, if said gas stream is said feed air, separating oxygen therefrom to produce said nitrogen product.

Purification of gases

An apparatus and process for separating perfluorocarbon compounds from a gas mixture passes an incoming stream of a gas into a cold trap, the gas stream including a plurality of perfluorocarbon compounds. The gas mixture is cooled within the cold trap to a temperature below &minus;100&deg; C. to produce a condensate that is enriched in at least one perfluorocarbon compound and a non-condensed stream from which the condensate was separated. The condensate is withdrawn from the cold trap. The condensate may be withdrawn by warming the cold trap to vaporize the condensate and thereafter flowing the vaporized condensate into a storage vessel. The non-condensed stream may be vented to the atmosphere, re-circulated into the cold trap or flowed through subsequent separation processes to extract additional perfluorocarbon compounds.

Reclamation and separation of perfluorocarbons using condensation

An adsorbent and method for making it and its use in removing water from gaseous hydrogen halide. Magnesium halide supported on an activated carbon prepared under vacuum will remove water at 1 to 500 ppm.

Vacuum preparation of hydrogen halide drier

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Bethlehem, PA, United States of America

Alexander Schwarz