Applied Materials, Inc.

Other

Alexander S Ko

Rick Endo

Steven Verhaverbeke

J Kelly Truman

Ralph M Wadensweiler

Martin Koebler

William D T Davis

Andr&eacute; Carpiaux

Timothy James Loew

Andreas Kaiser

Ivan Junju Huang

An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

Method and apparatus for wafer cleaning

According to one aspect of the present invention, a passive substrate gripper, including first and second segments, is provided. The second segment may be connected to the first segment, and the first and second segments may jointly form a substrate support. The substrate support may be shaped to support a substrate in first position within the substrate support when the substrate support is in a first angular orientation. The substrate may be removable from substrate support in a first direction when in the first position. The substrate may move into a second position when the substrate support is moved into a second angular orientation. The substrate may not be removable in the first direction when in the second position within the substrate support. The passive substrate gripper may also include a support ledge extending from opposing inner surfaces of the first and second segments, on which the substrate is supported.

Semiconductor substrate processing apparatus with a passive substrate gripper

A method of and apparatus for mixing chemicals in a single wafer process. According to the present invention a chemical is fed into a valve system having a tube of a known volume. The chemical is fed into the valve system to fill the tube with a chemical to generate a measured amount of the chemical. The measured amount of chemical is then used in a single wafer process.

Method and apparatus for chemical mixing in a single wafer process

The wheel suspension of the invention is a thin-profile wheel suspension system including spring and dampening mechanisms and an optional brake and drive motor, mounted to a suspension frame in a compact arrangement which permits all or most of the sprung components to be mounted within the volume enclosed by the rim of a wheel, and thus the wheel suspension of the invention may be referred to as an &ldquo;in-wheel suspension&rdquo;. The wheel suspension comprises a hub plate assembly including hub bearings and axle. The hub plate is mounted to a suspension frame by a motion-controlling sliding mount assembly, which connects the hub plate to the suspension frame while it permits the hub plate to slidably move in response to wheel loads. In the preferred embodiment, the suspension frame includes two forks, each fork mounting a sliding rail mount assembly comprising a slide-and-rail mechanism aligned vertically on the suspension frame and mounted to the hub plate. A spring mechanism such as a conventional piston-type shock absorber is mounted connecting to both the hub plate and the suspension frame to provide resilient motion control of the hub plate in response to vehicle weight, vehicle motion and road shock.

In-wheel suspension

Growing community of inventors

Santa Clara, CA, United States of America

Alexander S Ko