Other

Presco, Inc.

Asta Corporation

Agng, LLC

Alexander S Gotman

Stanislav A Garyainov

Vladimir V Novikov

A method for assembling semiconductor packages () includes forming corresponding pairs of conductive pads () on respective surfaces of a die () and an interconnective substrate (). Each pad in each pair includes an upper portion comprising at least one component of an electrically conductive eutectic alloy. Sharp, upstanding peaks () are formed on at least one of the pads in each pair. The die and substrate are forcefully abutted and the pads heated until the sharp peaks penetrate through oxide films () on the respective opposing pads in each pair and contact the upper surface of the other pad therein, thereby initiating pad fusion. The pads are then cooled to solidify the molten portions thereof into an electrically conductive joint between each corresponding pair of pads and a hermetic seal around the periphery of the package.

Fluxless assembly of chip size semiconductor packages

A reversible hand operated rotary power tool contains an internal mechanism for reducing the reaction torque that would otherwise be exhibited directly upon the housing, and hence imposed upon the hand of the operator. The mechanism is bidirectional, and reduces reaction torque to the same extent whether the tool is being operated in a forward direction or in a reverse direction. The mechanism includes a planetary differential mechanism having an input driven from a powered rotor, one separate output that is drivingly coupled to an output shaft, and another separate output that is drivingly coupled to an offset shaft that is laterally offset from the axis of the powered rotor. A lever system is employed to inhibit rotation of the offset shaft in either direction relative to the housing and thereby reduce reaction torque exhibited on the housing.

Mechanism for conteracting reaction torque in a powered, reversible,

A powered hand-held rotary tool adapted for preventing an externally manifested reaction torque upon the hand of an operator consists of a housing, a rotor adapted to be driven for rotation relative to the housing, and a planetary differential mechanism having a sun gear coaxial with and driven from the rotor, planetary gears, and a ring gear. The ring gear is rotatable relative to the housing. A first output gear is coaxial with the sun gear and rotatably driven by the planetary gears. An additional output gearing is rotatably supported from the housing on an axis that is laterally offset from the axis of the rotor, and is drivingly engaged by the ring gear. Rotation of the additional gearing in one direction relative to the housing is inhibited.

Mechanism in a powered hand-held rotary driver for counteracting

A differential rotary driver includes a power input shaft, a differential gear mechanism arranged coaxial to the power input shaft and having two output gears with mutually opposite rotations, and a housing which rotatably supports both input shaft and differential gear mechanism. The housing also has a rigid, crank-shaped lateral extension portion. Within the lateral extension portion of the housing both a central output shaft and a circumferentially concentric output shaft are rotatably supported on an axis which is laterally offset relative to the axis of the input shaft. Driving gears provided on the two output shafts are driven by corresponding output gears of the differential mechanism. When rotary power is applied between the housing and the power input shaft, an operator holding the housing experiences no reaction torque at any stage of the tightening of a fastener. The gear ratios may be selected such that the output torque of the circumferential output shaft is at least twice the output torque of the central output shaft.

Reactionlless differential rotary driver having optimized output torques

A driver with automatic speed and torque switching including two different drive trains which operate in parallel and are driven at the same time by a motor. One drive train provides a high-speed output while the other provides a low-speed output. A single drive head for transmitting torque to the nut is normally coupled to the high-speed output, and not to the low-speed output. The machine operates initially at the high speed for the 'free rotation' of the nut. When the nut contacts the surface of the structural body, the drive coupling to the high-speed output is disabled, and the low-speed output (which formerly was not coupled to the drive head) is not at the same time coupled to the drive head. The nut is then driven much more slowly but with a higher driving torque. Within the low-speed drive train there is included a friction clutch, and adjustement means for adjusting the level of torque at which it will slip. This clutch is therefore set for the predetermined counter-torque that is to cause driving rotation to be terminated.

Rotating driver with automatic speed switching and torque limiting

A three-piece fastener includes a bolt with a shank having a concentric opening in its threaded end, a nut adapted to fit over the threaded end of the bolt, and a wedge member which is insertable into the end opening of the bolt for expanding and thereby securing it. The threaded end of the bolt is axially slotted to facilitate its expansion. The outer diameter of the wedge member is smaller than the outer diameter of the threaded end of the bolt. When the bolt is to be inserted into an opening of a structure in order to accomplish a fastening action, the wedge member is first loosely inserted into the end opening of the bolt. Then when the bolt and wedge are passed through the opening, the nut is applied to the end of the bolt and is tightened. Thereafter, the wedge is tightened in order to expand the end of the bolt. The end opening of the bolt has interior threads, and is threadedly engaged by the wedge member, but in an opposite rotational sense to that in which the nut is applied to the bolt. The wedge member has a driving portion on its outer end, and a weakened circumferential wall which fractures and shears off when a predetermined torque is applied for tightening the wedge member. After this shearing action takes place, the remaining part of the wedge member is wholly contained within the end of the bolt.

Secure three-piece threaded fastener, and method

A driver with automatic speed and torque switching including two different drive trains which operate in parallel and are driven at the same time by a motor. One drive train provides a high-speed output while the other provides a low-speed output. A single drive head for transmitting torque to the nut is normally coupled to the high-speed output, and not to the low-speed output. The machine operates initially at the high speed for the 'free rotation' of the nut. When the nut contacts the surface of the structural body, the drive coupling to the high-speed output is disabled, and the low-speed output (which formerly was not coupled to the drive head) is not at the same time coupled to the drive head. The nut is then driven much more slowly but with a higher driving torque. Within the low-speed drive train there is included a friction clutch, and adjustment means for adjusting the level of torque at which it will slip. This clutch is therefore set for the predetermined counter-torque that is to cause driving rotation to be terminated.

Rotating driver with automatic speed and torque switching

In a manufacturing operation, a stretched diaphragm is used to support a quantity of small parts which are individually secured to the diaphragm in predetermined spaced relation. An individual part is elevated relative to the remainder of the array, for purpose of inspection or test, by displacing and even further stretching the associated portion of the diaphragm; then it is permitted to return to its original place in the array. When the parts are to be incorporated into manufactured assemblies each selected part is again elevated by displacing and stretching the associated portion of the diaphragm. The method is applied to the manufacture of microminiature electric circuits in which a flat wafer is first formed, and the wafer is then cut into a number of chips which must be individually tested and then they are incorporated into circuit assemblies. Apparatus for carrying out the method includes a support member having a flat upper surface, an annular opening in the flat surface forming a suction ring, means for applying vacuum to the suction ring, a central hole in the flat surface within the suction ring, and a pusher member that can be selectively raised from within the central hole. The apparatus also includes means for creating a vacuum at the periphery of the central hole, and internal controls for controlling the sequence of operation of the two vacuum means and the pusher member.

Apparatus for manipulating a stretched resilient diaphragm

In securing a semiconductor chip to a substrate of ceramic material or the like, a de-focused laser beam having a wave length to which the substrate is substantially opaque is directed over a relatively large area of the reverse side of the substrate. Heat generated at the reverse side of the substrate then flows through the substrate to heat bonding material that is placed between the engaging surfaces of the chip and substrate. In this manner direct heating of the chip is avoided or minimized, and damage to both chip and substrate is also minimized.

Laser bonding of microelectronic circuits

A mechanism for quickly and precisely positioning one body relative to another body, which relies upon three support points between the two bodies. At a first point a hemispherical surface is received in an opening having the form of a trihedral pyramid. At a second support point a hemispherical surface is received in an opening having the form of a diahedral prism. At the third support point a rigid sphere held in loose confinement engages a flat surface.

Precise quick-release positioning mechanism

A method of coating a thin layer of a liquid material on a substrate, in which the substrate is placed in an atmosphere saturated with the vapor of a solvent for the coating material, liquid coating material is deposited on the substrate, and then the substrate is spun to disperse the coating material into a thin film while causing the excess to run off. The vaporous solvent atmosphere is maintaind while the coating and run-off are completed. Then the substrate is isolated from the source of the solvent vapor and is heated in order to dry the coating. Apparatus for carrying out this method includes a coating chamber, a carrier adapted to receive and support the substrate, a turntable within the coating chamber for rotating the substrate carrier, and means in the coating chamber for generating the vaporous atmosphere. The apparatus also includes a separate drying chamber that is movable into or out of engagement with the coating chamber, and openings in both chambers which provide communication between them when they are in mutual engagement. Means are also provided to transfer the carrier from the coating chamber to the drying chamber, and at the same time sealing off the coating chamber to limit the amount of vaporous solvent flowing into the drying chamber. The apparatus also includes multiple drying chambers, multiple substrate carriers normally carried in corresponding ones of the drying chambers, and means for presenting the drying chambers in succession to the coating chamber so that while a newly coated substrate is being dried the next succeeding substrate can be transferred from its drying chamber into the coating chamber for coating.

Process for applying a thin coating in liquid form and subsequently

In a manufacturing operation, a stretched diaphragm is used to support a quantity of small parts which are individually secured to the diaphragm in predetermined spaced relation. An individual part is elevated relative to the remainder of the array, for purpose of inspection or test, by displacing and even further stretching the associated portion of the diaphragm; then it is permitted to return to its original place in the array. When the parts are to be incorporated into manufactured assemblies each selected part is again elevated by displacing and stretching the associated portion of the diaphragm. The method is applied to the manufacture of microminiature electric circuits in which a flat wafer is first formed, and the wafer is then cut into a number of chips which must be individually tested and then they are incorporated into circuit assemblies.

Growing community of inventors

Santa Monica, CA, United States of America

Alexander S Gotman