Heraeus Deutschland Gmbh & Co Kg

Curamik Electronics Gmbh

Heraeus Electronics Gmbh & Co. Kg

Alexander Rogg

Jürgen Schulz-Harder

Christian Muschelknautz

Kai Herbst

Bogdan Lisca

Karl Exel

Andreas Karl Frischmann

Richard Wacker

The invention relates to a copper-ceramic composite, comprising a ceramic substrate, which contains aluminum oxide, a coating on the ceramic substrate made of copper or a copper alloy, wherein the aluminum oxide has an average grain form factor R(AlO), determined as an arithmetic average value from the form factors of the grains of the aluminum oxide, the copper or the copper alloy has an average grain form factor R(Cu), determined as an arithmetic average of the form factors of the grains of the copper or copper alloy, and the average grain form factors of the aluminum oxide and copper or copper alloy meet the following condition: 0.5&#x2264;R(AlO)/R(Cu)&#x2264;2.0.

Copper-ceramic composite

A ceramic-metal substrate in which the ceramic substrate has a low content of an amorphous phase. The ceramic-metal substrate includes a ceramic substrate and on at least one side of the ceramic substrate a metallization. The ceramic-metal substrate has at least one scribing line, at least one cutting edge, or both at least one scribing line and at least one cutting edge. Amorphous phases extend parallel to the scribing line and/or the cutting edge in a width of at most 100 &#x3bc;m or of at least 0.50 &#x3bc;m.

Ceramic-metal substrate with low amorphous phase

The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.

Laser cutting of metal-ceramic substrates

The invention relates to a copper/ceramic composite comprising&#x2014;a ceramic substrate which contains aluminum oxide, &#x2014;a coating which lies on the ceramic substrate and which is made of copper or a copper alloy, wherein the copper or the copper alloy has a particle size number distribution with a median value d, an arithmetic mean value d, and a symmetry value S(Cu)=d/d; the aluminum oxide has a particle size number distribution with a median value d, an arithmetic mean value d, and a symmetry value S(AlO)=d/d; and S(AlO) and S(Cu) satisfy the following condition: 0.7&#x2264;S(AlO)/S(Cu)&#x2264;1.4.

Copper/ceramic composite

A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, AlO, TiO, ZrO, MgO, CaO CaCOor a mixture of at least two of said materials.

Growing community of inventors

Trabitz, Germany

Alexander Rogg