Coolit Systems, Inc.

Alexander Robin Walter Scott

A housing can have a cap, a base member and a mid-portion positioned between and removably coupled with the cap and the base member. The cap and the mid-portion can define a reservoir therebetween and the cap can define a recessed inner wall in fluid communication with the reservoir. The mid-portion can define a recessed impeller chamber configured to receive a pump impeller. The mid-portion can further define a retainer positioned between the impeller chamber and the inner chamber. A resiliently compressible member can be positioned within the inner chamber and configured to resiliently compress in response to a volumetric expansion of the liquid coolant. The retainer can contact the resiliently compressible member to prevent the resiliently compressible member from moving out of the reservoir or into a position blocking a liquid coolant flow through a port. The mid-portion can define a housing wall forming the retainer.

Pump expansion vessel

A pump can have a housing defining therein an inner chamber of fixed volume. An inlet through the housing can provide communication to the inner chamber and an outlet through the housing can provide communication to the inner chamber. A pumping mechanism can be positioned in the inner chamber. A resiliently, compressible member can accommodate a portion of the fixed volume of the inner chamber.

An apparatus for cooling an electronic device that includes a fluid heat exchanger, a chiller, and a pump. The fluid heat exchanger transfers heat from a hot portion of the surface of the electronic device to a fluid and has a body through which the fluid may be circulated. The body has a protrusion having a first surface that may be thermally coupled to the hot portion such that the surface of the body is sufficiently distant from the surface of the electronic device that sufficient ambient air may circulate therebetween so as to substantially prevent condensation from forming on the surface of the electronic device and from forming on and dripping from the heat exchanger when the fluid is cooled to at least the dew point of the ambient air and circulated through the body. A heat-conducting path is provided from the first surface to a region of the body that is thermally coupled to the fluid when the fluid is circulated through the body. The chiller circulates the fluid through a chiller and the fluid heat exchanger.

Computer cooling apparatus

Computer device mounting clip

A heat sink is described for extracting heat from at least one electronic device, such as a microprocessor, either directly or indirectly (i.e. via liquid coolant). The heat sink includes a first thermal plate, a second thermal plate and a plurality of fins integral with and extending between both the first thermal plate and the second thermal plate.

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Calgary, Canada

Alexander Robin Walter Scott