Infineon Technologies Ag

Infineon Technologies LLC

Alexander Olbrich

Martin Ostermayr

Thomas Nirschl

Hans-Joachim Barth

Vincent Gouin

Klaus Schrüfer

Christophe Chanussot

A semiconductor memory cell and production method provides a storage capacitor connected to a selection transistor. The storage capacitor is formed as a contact hole capacitor in at least one contact hole for a source or drain region. Such a semiconductor memory cell can be produced cost-effectively and allows a high integration density.

Semiconductor memory cell and corresponding method of producing same

A memory cell having three transistors and a capacitor having metallic electrodes is described. Multiple memory cells may be arranged in a memory unit or array. Collective electrodes may be used in a space-saving embodiment of the capacitor.

Multi-transistor memory cells

A bit line dummy core-cell comprises at least a first inverter and at least a second inverter which are cross coupled to form a bistable flip-flop. The first inverter comprises a first PMOS transistor and a first NMOS transistor connected in series by means of a first internal storage node between a high reference potential and a low reference potential. The second inverter comprises a second PMOS transistor and a second NMOS transistor connected in series by means of a second internal storage node. The source of the second PMOS transistor and the second internal storage node are connected to the low reference potential so that the first internal storage node always stores a logic high level. A first access transistor is coupled between a dummy bit line providing a self-timing signal and the first internal node storing the logical high level.

Bit line dummy core-cell and method for producing a bit line dummy core-cell

A semiconductor memory cell and an associated fabrication method are provided in which a storage capacitor is connected to a selection transistor. The storage capacitor is formed in a trench of a semiconductor substrate. At the trench surface, a capacitor dielectric and an electrically conductive filling layer are formed thereon for realization of a capacitor counterelectrode. The filling layer has a projection that extends outside the trench as far as the drain region and is electrically connected thereto.

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Hohenbrunn, Germany

Alexander Olbrich