Infineon Technologies Ag

Alexander Nielsen

Georg Georgakos

Bernhard Dobler

A layout structure is provided with a conducting line extending in a conducting line direction, the conducting line being arranged within a substrate area, a fill element being arranged within the substrate area at a predetermined distance from the conducting line, the fill element having a fill element axis extending perpendicularly to a side of the fill element in a fill element direction, an angle between the conducting line direction and the fill element direction being greater than 0&#xb0; and smaller than 90&#xb0;.

Layout structure having a fill element arranged at an angle to a conducting line

A multiple gate field-effect transistor is built from an overlapping mesh assembly. The assembly comprises a first layer comprising a semiconductor material formed into at least one fin, at least one source, and at least one drain. The first layer comprises a portion of a first mesh, electrically separated from the rest of the mesh. Similarly, a second layer is formed over the first layer and electrically isolated from the first layer, the second layer being electrically conductive and comprising a gate for the at least on fin of the transistor. The second layer comprises a portion of a second mesh offset from the first mesh and overlapping the first mesh, the second layer of the MuGFET device electrically separated from the rest of the second mesh.

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Ingolstadt, Germany

Alexander Nielsen