Schweizer Electronic Ag

Robert Boschgmbh

Continental Automotive Gmbh

Vitesco Technologies Gmbh

Alexander Neumann

Thomas Gottwald

Andreas Kugler

Hubert Trageser

Ulrich Schaaf

Christian Roessle

Karl-Friederich Becker

Jan Kostelnik

A circuit board (&#x2033;) includes at last one insulating substrate layer (SL, SL, SL, SL, SL) and a plurality of electrically conductive copper coats (C, C, C) arranged on the at least one insulating substrate layer (SL, SL, SL, SL, SL), wherein at least one of the electrically conductive copper coats (C, C, C) is coated at least on both sides with a layer (HSI, HS, HS) made of a material for inhibiting electromigration, wherein on a layer (HS, HS) made of a material for inhibiting electromigration a further metal layer (M, M, M, M') is provided, which is in turn coated with a further layer (HS, HS&#x2032;) made of a material for inhibiting electromigration.

Circuit board and method for production thereof

A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts&#x2014;connected thereto via leads&#x2014;for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.

Radio frequency transmitting/receiving element and method for producing a radio frequency transmitting/receiving element

An electronic sub-assembly () comprising at least one electronic component () embedded in a sequence of layers, wherein the electronic component () is arranged in a recess of an electrically conductive central layer () and directly adjoins a resin layer () on each side.

Electronic sub-assembly and method for the production of an electronic sub-assembly

Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided.

Electronic sub-assembly, a method for manufacturing the same, and a printed circuit board with electronic sub-assembly

The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.

Conductor structure element and method for producing a conductor structure element

In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.

Growing community of inventors

Rottweil, Germany

Alexander Neumann