Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Technische Universitaet Berlin

Robert Boschgmbh

Würth Elektronik Gmbh &Co. Kg

Alexander Neumann

Andreas Kugler

Andreas Ostmann

Dionysios Manessis

Ulrich Schaaf

Rainer Patzelt

Karl-Friederich Becker

Jan Kostelnik

A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.

Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate

Growing community of inventors

Berlin, Germany

Alexander Neumann