Nanoplus Gmbh

Topapex Environment Protection Energy Co., Ltd

Alexander Naumov

Hung-Tu Lu

Vladimir Kondratenko

Wei-Nung Hsu

Chih-Peng Hsu

Hung-tu Lu

Chih-peng Hsu

Wei-nung Hsu

The present invention discloses that a multi-laser cutting method and system, which is applied to a substrate to form a primary substrate having a pattern of rounded corners and a line, the throughput could be improved because COlaser cannot cut the round corner at the high speed, but the substrate strength could be kept due to the high cutting quality of the lines by COlaser. The poor quality of the cutting edges of the round corners will not affect on the substrate strength but the round corner cutting by the second laser unit will speed up the cutting process. The present invention applies the method by the 2 different laser machines to balance the throughput. Because at the same speed, for example 150 mm/sec, the cycle time per 1 substrate will be different due to the different length of the cutting lines.

Multi-laser cutting method and system thereof

A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

Brittle object cutting apparatus and cutting method thereof

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Moscow, Russia

Alexander Naumov