Applied Materials, Inc.

Alta Devices, Inc.

Alexander N Lerner

Khurshed Sorabji

Joseph Michael Ranish

Blake R Koelmel

Roey Shaviv

Prashanth Kothnur

Aaron Muir Hunter

Kim Ramkumar Vellore

Kedarnath Sangam

Satish Radhakrishnan

Mehran Behdjat

Ajay Kumar

Brian J Brown

Wolfgang R Aderhold

Boris Fishkin

Michael N Sugarman

Kevin Vincent Moraes

Brad Eaton

Abhilash J Mayur

Nir Merry

Jianshe Tang

Sundar Ramamurthy

Jeffrey Allen Brodine

Andrew J Constant

Michael P Karazim

Steven Trey Tindel

Shijian Li

James S Papanu

Norman L Tam

Agus Sofian Tjandra

Yoshitaka Yokota

Haoquan Fang

Younes Achkire

Boris T Govzman

Robert Navasca

Ming-Kuei (Michael) Tseng

Guy Shirazi

John M White

Wei-Sheng Lei

Joseph Yudovsky

Rashid Mavliev

Gregg Higashi

Steven Victor Sansoni

Lori D Washington

James Matthew Holden

Donald J K Olgado

Alan Hiroshi Ouye

Anh Ngoc Nguyen

Henry Ho

Wenguang Li

Lily L Pang

Prabhat Kumar

Aparna Iyer

Kai Ma

Bernardo Donoso

Graeme Jamieson Scott

Phillip Stout

Robert C McIntosh

Niranjan Kumar

Xiaozhou Che

David D L Larmagnac

Dmitry Lubomirsky

Manoocher Birang

Michael Xiaoxuan Yang

Tetsuya Ishikawa

Avi Tepman

Bruce E Adams

Ming Xi

Andreas G Hegedus

Son Truong Nguyen

Arulkumar P Shanmugasundram

Makoto Inagawa

Jonathan Stuart Frankel

Timothy N Thomas

Allen L D'Ambra

Jungrae Park

Brian Hayes Burrows

Daniel Lee Diehl

Oleg V Serebryanov

David Masayuki Ishikawa

Joseph Stevens

Yeuk-Fai Edwin Mok

Russell C Ellwanger

Vladimir Galburt

Ozkan Celik

Rajesh S Ramanujam

Yevgeniy Rabinovich

Ramesh Krishnamurthy

Amikam Sade

Patricia A Schulze

Ami Sade

Svetlana Sherman

Harshad M Borgaonkar

Abril Cabreros

Eric B Britcher

Paula Valdivia

Greg Freeman

Rashid Mavleiv

Donald Olgato

Daniel D Ramar

One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.

Methods for forming films on substrates

Methods and apparatus for controlling a flow of process material to a deposition chamber. In embodiments, the apparatus includes a deposition chamber in fluid communication with one or more sublimators through one or more delivery lines, wherein the one or more sublimators each include an ampoule in fluid communication with the one or more delivery lines through an opening, and at least a first heat source and a second heat source, wherein the first heat source is a radiant heat source adjacent the ampoule and the second heat source is adjacent the opening, wherein the one or more delivery lines include one or more conduits between the deposition chamber and the one or more sublimators, and wherein the one or more conduits include one or more valves to open or close the one or more conduits, wherein the one or more valves in an open position prevents the flow of process material into the deposition chamber, and wherein the one or more valves in a closed position directs the flow of process material into the deposition chamber.

Apparatus and method for controlling a flow process material to a deposition chamber

Methods of introducing precursors through a segmented showerhead are provided herein. In some embodiments, a method of introducing precursors through a segmented showerhead having a plurality of gas delivery portions that are fluidly isolated includes heating a first gas delivery portion to a first temperature; and simultaneously heating a second gas delivery portion to a second temperature different than the first temperature, wherein each of the first and second gas delivery portions (i) have a wedge shaped body that defines a plenum, (ii) are coplanar, and (iii) together form a showerhead having a circular shape.

Methods of using a segmented showerhead for uniform delivery of multiple pre-cursors

Embodiments of a showerhead are described herein. In some embodiments, a showerhead assembly includes: a first gas delivery portion having a first body, a first inlet, and a plurality of first tubes extending from the first body and defining a first plenum, wherein each tube of the plurality of first tubes includes a plurality of first holes; and a second gas delivery portion having a second body, a second inlet, and a plurality of second tubes extending from the second body and defining a second plenum fluidly independent from the first plenum, wherein each tube of the plurality of second tubes includes a plurality of second holes, and wherein the plurality of first tubes are disposed in an alternating pattern with the plurality of second tubes across a width of the showerhead assembly and a heat sink disposed between the plurality of first tubes and the plurality of second tubes.

Showerhead for providing multiple materials to a process chamber

Apparatus for supplying vaporized reactants to a reaction chamber are described herein. In some embodiments, a showerhead assembly for depositing multiple materials on a substrate includes a plurality of gas delivery portions, each gas delivery portion having an inlet, a wedge shaped body that defines a plenum, and a plurality of openings disposed on a bottom surface of the gas delivery portion, wherein each of the plenums are fluidly isolated from each other.

Segmented showerhead for uniform delivery of multiple precursors

A carrier FOUP and a method of placing a carrier are provided. The carrier FOUP includes a body and a door. The body includes a plurality of chamfers, and one or more carriers are placed on, and supported by, the plurality of chamfers. The method of placing a carrier includes placing the carrier in the carrier FOUP and closing the door of the carrier FOUP. When the door is closed, the door pushes against the carrier and aligns the carrier with the alignment feature. The alignment features align the carrier, removing the need to be aligned by the factory interface robot when placing or removing the carrier from the carrier FOUP.

Carrier FOUP and a method of placing a carrier

One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, process chamber is provided that includes a lid plate having a plurality of cooling channels formed therein, a pedestal, the pedestal having a plurality of cooling channels formed therein, and a showerhead, wherein the showerhead comprises a plurality of segments and each segment is at least partially surrounded by a shield.

Evaporator chamber for forming films on substrates

An alignment module for housing and cleaning masks. The alignment module comprises a mask stocker, a cleaning chamber, an alignment chamber, an alignment stage a transfer robot. The mask stocker is configured to house a mask cassette configured to store a plurality of masks. The cleaning chamber is configured to clean the plurality of masks by providing one or more cleaning gases into a chamber after a mask is inserted into the cleaning chamber. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer a mask from one or more of the alignment stage and the mask stocker to the cleaning chamber.

Alignment module with a cleaning chamber

Generally, examples described herein relate to deposition masks and methods of manufacturing and using such deposition masks. An example includes a method for forming a deposition mask. A mask layer is deposited on a substrate. Mask openings are patterned through the mask layer. A central portion of the substrate is removed to define a substrate opening through a periphery portion of the substrate. The mask layer with the mask openings through the mask layer extending across the substrate opening.

Deposition mask and methods of manufacturing and using a deposition mask

An alignment module for positioning a mask on a substrate comprises a mask stocker, an alignment stage, and a transfer robot. The mask stocker houses a mask cassette that stores a plurality of masks. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer one of the one or more masks from the mask stocker to the alignment stage and position the mask over the substrate. The alignment module may be part of an integrated platform having one or more transfer chambers, a factory interface having a substrate carrier chamber and one or more processing chambers. A carrier may be coupled to a substrate within the substrate carrier chamber and moved between the processing chambers to generate a semiconductor device.

System and method for aligning a mask with a substrate

Methods and systems for forming films on substrates in semiconductor processes are disclosed. The method includes providing different materials each contained in separate ampoules. Material is flowed from each ampoule into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.

Deposition chamber showerhead

Showerhead reflector

Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.

Processing system for forming layers

Methods and apparatus for controlling a flow of process material to a deposition chamber. In embodiments, the apparatus includes a deposition chamber in fluid communication with one or more sublimators through one or more delivery lines, wherein the one or more sublimators each include an ampoule in fluid communication with the one or more delivery lines through an opening, and at least a first heat source and a second heat source, wherein the first heat source is a radiant heat source adjacent the ampoule and a second heat source is adjacent the opening, wherein the one or more delivery lines include one or more conduits between the deposition chamber and the one or more sublimators, and wherein the one or more conduits include one or more valves to open or close the one or more conduits, wherein the one or more valves in an open position prevents the flow of process material into the deposition chamber, and wherein the one or more valves in a closed position directs the flow of process material into the deposition chamber.

Growing community of inventors

San Jose, CA, United States of America

Alexander N Lerner